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3D numerical modeling of a new thermo-inductive NDT using pulse mode and pulsed phase methods

Published online by Cambridge University Press:  21 October 2010

B. Ramdane ,
D. Trichet ,
M. Belkadi ,
T. Saidi  and
J. Fouladgar
B. Ramdane*
Affiliation:
Institut de Recherche en Électrotechnique et Électronique de Nantes Atlantique (IREENA), 37 boulevard de l'Université, BP 406, 44600 Saint-Nazaire Cedex, France
D. Trichet
Affiliation:
Institut de Recherche en Électrotechnique et Électronique de Nantes Atlantique (IREENA), 37 boulevard de l'Université, BP 406, 44600 Saint-Nazaire Cedex, France
M. Belkadi
Affiliation:
Institut de Recherche en Électrotechnique et Électronique de Nantes Atlantique (IREENA), 37 boulevard de l'Université, BP 406, 44600 Saint-Nazaire Cedex, France
T. Saidi
Affiliation:
Institut de Recherche en Électrotechnique et Électronique de Nantes Atlantique (IREENA), 37 boulevard de l'Université, BP 406, 44600 Saint-Nazaire Cedex, France
J. Fouladgar
Affiliation:
Institut de Recherche en Électrotechnique et Électronique de Nantes Atlantique (IREENA), 37 boulevard de l'Université, BP 406, 44600 Saint-Nazaire Cedex, France
*
brahim.ramdane@univ-nantes.fr
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Abstract

Thermo-inductive testing is a new technique used for health inspection on different components of automotive and aeronautic industries. Defect detection is based on the modification of induced eddy current and temperatures due to the presence of defects. The temperature change propagated at the surface of the specimen can then be detected by an infrared camera. In this work, a 3D numerical model of this technique is developed and applied to aeronautic materials. Results obtained are compared with the infrared thermography method to demonstrate the relevance of the new technique.

Information

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 52 , Issue 2: Focus on Numelec , November 2010 , 23301
Copyright
© EDP Sciences, 2010

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References

B. Ramdane, D. Trichet, M. Belkadi, J. Fouladgar, T. Saidi, in Proc. 13th IEEE CEFC, Athens, Greece, 2008, p. 418
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