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Efficient FEM modeling of printed coils for eddy current testing*

Published online by Cambridge University Press:  08 November 2013

Houda Zaidi*
Affiliation:
Laboratoire de Génie Electrique de Paris - UMR 8507 CNRS - Supelec - Univ. Paris-Sud and UPMC Plateau de Moulon, 91192 Gif-sur-Yvette Cedex, France CEA, LIST, 91191 Gif-sur-Yvette Cedex, France
Laurent Santandrea
Affiliation:
Laboratoire de Génie Electrique de Paris - UMR 8507 CNRS - Supelec - Univ. Paris-Sud and UPMC Plateau de Moulon, 91192 Gif-sur-Yvette Cedex, France
Guillaume Krebs
Affiliation:
Laboratoire de Génie Electrique de Paris - UMR 8507 CNRS - Supelec - Univ. Paris-Sud and UPMC Plateau de Moulon, 91192 Gif-sur-Yvette Cedex, France
Yann Le Bihan
Affiliation:
Laboratoire de Génie Electrique de Paris - UMR 8507 CNRS - Supelec - Univ. Paris-Sud and UPMC Plateau de Moulon, 91192 Gif-sur-Yvette Cedex, France
Edouard Demaldent
Affiliation:
CEA, LIST, 91191 Gif-sur-Yvette Cedex, France
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Abstract

In this paper an approach for the modeling of the eddy current testing of a conductive part with flat printed coils is proposed. The overlapping finite element method is implemented for this purpose. It is shown that this approach allows simplifying the modeling of eddy current testing configurations that use this kind of coil.

Type
Research Article
Copyright
© EDP Sciences, 2013

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Footnotes

*

Contribution to the Topical Issue “Numelec 2012”, Edited by Adel Razek.

References

Ravat, C., Joubert, P.-Y., Le Bihan, Y., Marchand, C., Woytasik, M., Dufour-Gergam, E., Sen. Lett. 7, 400 (2009)CrossRef
Marchand, B., Decitre, J.M., Casula, O., Prog. Quant. Nondestructive Eval. 29, 385 (2010)
Zaidi, H., Santandréa, L., Krebs, G., Le Bihan, Y., Demaldent, E., IEEE Trans. Magn. 48, 583 (2012)CrossRef
Zaidi, H., Santandréa, L., Krebs, G., Le Bihan, Y., Demaldent, E., International Symposium on Applied Electromagnetics and Mechanics (ISEM), Napoli, Italy, 2011
Ren, Z., Razek, A., Int. J. Num. Model. Electron. Netw. Dev. Fields 9, 81 (1996)3.0.CO;2-J>CrossRef
Bensetti, M., Choua, Y., Santandrea, L., Le Bihan, Y., Marchand, C., IEEE Trans. Magn. 44, 1646 (2008)CrossRef
Ren, Z., IEEE Trans. Magn. 34, 2547 (1998)
Chang-Hwan, I., Hong-Kyu, K., Hyun-Kyo, J., IEEE Trans. Magn. 38, 505 (2008)CrossRef
Dodd, C.V., Deeds, W.E., J. Appl. Phys. 39, 2829 (1967)CrossRef
Choua, Y., Santandréa, L., Le Bihan, Y., Marchand, C., IEEE Trans. Magn. 46, 2795 (2010)CrossRef
Pichenot, G., Reboud, C., Raillon, R., Mahaut, S., Ann. Rev. Prog. QNDE Proc. 1975 (2007)
Ditchburn, R.J., Burke, S.K., Posada, M., J. Nondestructive Eval. 22, 63 (2003)CrossRef