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A study of BGaN back-barriers for AlGaN/GaN HEMTs

Published online by Cambridge University Press:  26 November 2012

Jeramy R. Dickerson
Affiliation:
Unité Mixte Internationnale UMI 2958 Georgia Tech-CNRS, F-57070 Metz, France School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
Vinod Ravindran
Affiliation:
Unité Mixte Internationnale UMI 2958 Georgia Tech-CNRS, F-57070 Metz, France School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
Tarik Moudakir
Affiliation:
Unité Mixte Internationnale UMI 2958 Georgia Tech-CNRS, F-57070 Metz, France
Simon Gautier
Affiliation:
Unité Mixte Internationnale UMI 2958 Georgia Tech-CNRS, F-57070 Metz, France
Paul L. Voss*
Affiliation:
Unité Mixte Internationnale UMI 2958 Georgia Tech-CNRS, F-57070 Metz, France School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
Abdallah Ougazzaden
Affiliation:
Unité Mixte Internationnale UMI 2958 Georgia Tech-CNRS, F-57070 Metz, France School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
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Abstract

We study the use of a BGaN back-barrier layer in the GaN buffer of AlyGa1−yN/GaN highelectron mobility transistors to improve confinement of carriers in the 2D electron gas region. Unlike InGaN back-barrier designs, whose polarization-induced sheet charges form an electrostatic barrier at the backbarrier/ buffer interface, BGaN back-barrier designs create an electrostatic barrier at the channel/backbarrier interface. This can result in carrier confinement to sub-15 nm thickness, even when the channel is 30 nm wide. Although polarization sheet charges due to the BGaN back-barrier form a secondary well at the back-barrier/buffer interface, increasing the thickness of the back-barrier may move the secondary well so that it no longer interacts with the primary channel.

Type
Research Article
Copyright
© EDP Sciences, 2012

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