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Particle damping optimization and multi-material additive manufacturing of an atom chip bracket: a case study

Published online by Cambridge University Press:  02 July 2026

Marcus Oel*
Affiliation:
Institute of Product Development (IPeG), Leibniz University Hannover, Germany
Leon Glitt
Affiliation:
Institute of Product Development (IPeG), Leibniz University Hannover, Germany
Mirco Jonkeren
Affiliation:
Institute of Dynamics and Vibration Research, Leibniz University Hannover, Germany
Weijia Yu
Affiliation:
Institute of Product Development (IPeG), Leibniz University Hannover, Germany
Myriam Maalaoui
Affiliation:
Institute of Product Development (IPeG), Leibniz University Hannover, Germany
Lennart Mesecke
Affiliation:
Institute of Product Development (IPeG), Leibniz University Hannover, Germany
Jens Niedermeyer
Affiliation:
Institute of Product Development (IPeG), Leibniz University Hannover, Germany
Sebastian Tatzko
Affiliation:
Institute of Dynamics and Vibration Research, Leibniz University Hannover, Germany
Ina Meyer
Affiliation:
Institute of Product Development (IPeG), Leibniz University Hannover, Germany
Jörg Wallaschek
Affiliation:
Institute of Dynamics and Vibration Research, Leibniz University Hannover, Germany
Roland Lachmayer
Affiliation:
Institute of Product Development (IPeG), Leibniz University Hannover, Germany

Abstract:

The powder bed fusion by laser beam of metals (PBF-LB/M) offers the possibility of directly integrating particle dampers during manufacturing. Building on an existing optimization tool, this article investigates the optimization and multi-material additive manufacturing (AM) of a bracket for an atom chip of a quantum inertial sensor. The bracket is optimized in terms of mass, stiffness, and damping properties, and subsequently manufactured using Scalmalloy and tungsten in a PBF-LB/M process. The results provide findings into component design as well as into the pre-processing phase of AM.

Information

Type
DESIGN FOR ADDITIVE MANUFACTURING
Creative Commons
Creative Common License - CCCreative Common License - BYCreative Common License - NCCreative Common License - ND
This is an Open Access article, distributed under the terms of the Creative Commons Attribution-NonCommercial-NoDerivatives licence (https://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial re-use, distribution, and reproduction in any medium, provided the original work is unaltered and is properly cited. The written permission of Cambridge University Press must be obtained for commercial re-use or in order to create a derivative work.
Copyright
The Author(s), 2026
Figure 0

Figure 1. Manufacturing of an AMPD structure in the PBF-LB/M-process (Oel et al., 2025a)

Figure 1

Table 1. Parameters for topology and damping optimization

Figure 2

Figure 2. Component optimization and geometry reconstruction of atom chip bracket

Figure 3

Figure 3. Figure 3 long description.Offset of material transition contour for multi-material atom chip bracket with AMPD

Figure 4

Table 2. Parameters for laser processing and multi-material powder coating

Figure 5

Figure 4. Figure 4 long description.Pyrometry measurement of multi-material atom chip bracket with AMPD

Figure 6

Figure 5. (a) Powder bed of multi-material PBF-LB/M process, (b) finished multi-material bracket

Figure 7

Figure 6. Figure 6 long description.CT analysis of atom chip bracket variants: (a-c) mono-material AMPD, (d-f) multi-material AMPD

Figure 8

Figure 7. Setup for experimental testing: (a) schematic representation, (b) real setup

Figure 9

Figure 8. Figure 8 long description.Calculated dissipated energy at different frequencies and accelerations for mono- and multi-material AMPD