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Defining Residual Stresses in Thin Film Structures

Published online by Cambridge University Press:  06 March 2019

I. C. Noyan
I. C. Noyan*
Affiliation:
Thomas J. Watson Research Center IBM Research Division Yorktown Heights, NY
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Abstract

Residual stresses are found in the majority of multilayer thin film structures used in modem technology. The measurement and modeling of such stress fields and the elucidation of their effects on structural reliability and device operation has been a “growth area” in the literature, with contributions from authors in various scientific and engineering disciplines.

In this paper a review of the definitions of the residual stresses used by the authors in the various disciplines is presented and the mechanisms by which residual stresses may form in thin film systems is discussed.

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Type
VII. Stress Determination by Diffraction Methods
Information
Advances in X-Ray Analysis , Volume 35 , Issue A: First Pacific-International Congress on X-ray Analytical Methods (PICXAM). Fortieth Annual Conference on Applications of X-ray Analysis, August 7-16, 1991 , 1991 , pp. 461 - 473
Copyright
Copyright © International Centre for Diffraction Data 1991

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