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High Temperature Elastic Constant Prediction of Some Group III-Nitrides

Published online by Cambridge University Press:  13 June 2014

Robert R. Reeber
Affiliation:
Department of Materials Science and Engineering, North Carolina State University
Kai Wang
Affiliation:
Department of Materials Science and Engineering, North Carolina State University

Abstract

Thermoelastic properties are important for modeling thermal residual stresses and for optimizing the growth conditions of semiconductor thin films. Thermal expansions of AlN and GaN have been evaluated and predicted by us earlier [1][2]. Here, high temperature elastic constants are estimated empirically from corresponding state relationships and data from other hexagonal Grimm-Sommerfeld compounds. This information together with our earlier thermal expansion data will further improve capabilities for calculating thermal residual stresses in various semiconductor thin films.

Information

Type
Research Article
Copyright
Copyright © 2001 Materials Research Society
Figure 0

Table 1 Room temperature elastic constants and Debye temperatures for SiC, AlN, GaN and InN.

Figure 1

Table 2 Elastic Properties of 6H-SiC

Figure 2

Table 3 Elastic Properties of AlN

Figure 3

Table 4 Elastic Properties of GaN

Figure 4

Table 5 Elastic Properties of InN

Figure 5

Figure 1. Young’s Modulus of AlN

Figure 6

Figure 2. Temperature dependence of Young’s Modulus for AlN, GaN and InN.