Hostname: page-component-76d6cb85b7-6jg5l Total loading time: 0 Render date: 2026-07-14T11:22:41.546Z Has data issue: false hasContentIssue false

Design for AM: the impact of the shell feature on the residual stress in directed energy deposition components

Published online by Cambridge University Press:  02 July 2026

James Gopsill*
Affiliation:
University of Bristol, United Kingdom
Omar Yasin
Affiliation:
University of Bristol, United Kingdom
Aman Kukreja
Affiliation:
University of Bristol, United Kingdom

Abstract:

Residual stress is inherent in Additive Manufacturing process due to the heat cycling of the material being deposited on the build plate. The manufacturing toolpath can have a considerable effect on the development of residual stress distribution within a component. This paper examines the impact of the shell feature to generate some design heuristics on whether to include it when residual stress is of concern. The stress feature did increase the residual stressed observed during printing but was mitigated by the cooling regime after the process was complete.

Information

Type
DESIGN FOR ADDITIVE MANUFACTURING
Creative Commons
Creative Common License - CCCreative Common License - BYCreative Common License - NCCreative Common License - ND
This is an Open Access article, distributed under the terms of the Creative Commons Attribution-NonCommercial-NoDerivatives licence (https://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial re-use, distribution, and reproduction in any medium, provided the original work is unaltered and is properly cited. The written permission of Cambridge University Press must be obtained for commercial re-use or in order to create a derivative work.
Copyright
The Author(s), 2026
Figure 0

Figure 1. ‘Ping-back’ phenomena caused by the residual stress introduced by an AM process being released as the part is removed from the print bed (Takezawa et al., 2021)

Figure 1

Figure 2. Three type residual stress classification: type I macro-stresses remaining after plastic bending, type II intergranular stresses caused by preferred slip orientation misalignment and type III lattice stresses from substitutional atoms or vacancies (Bartlett & Li, 2019)

Figure 2

Figure 3. A 30mm x 60mm x 15mm component on a 70mm x 100mm x 10mm baseplate (not to scale)

Figure 3

Figure 4. Print patterns

Figure 4

Table 1. Material properties used for Inconel625

Figure 5

Table 2. Simulation statistics

Figure 6

Figure 5. Von Mises stress distribution through the component at the end of the simulation steps

Figure 7

Figure 6. Spatial stress distributions for s middle layer (7mm) of the component