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Role of Molecular Structure of Complexing/Chelating Agents in Copper CMP Slurries

Published online by Cambridge University Press:  01 February 2011

Udaya B. Patri ,
S. Pandija  and
S.V. Babu
Udaya B. Patri
Affiliation:
Department of Chemical Engineering, Center for Advanced Materials Processing, Clarkson University, Potsdam, NY 13699
S. Pandija
Affiliation:
Department of Chemical Engineering, Center for Advanced Materials Processing, Clarkson University, Potsdam, NY 13699
S.V. Babu
Affiliation:
Department of Chemical Engineering, Center for Advanced Materials Processing, Clarkson University, Potsdam, NY 13699
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Abstract

The role of the molecular structure - different functional groups, the length of the carbon chain and the relative positions of different functional groups – of several complexing/chelating agents (acetic acid, glycine, ethylene diamine, succinic acid, alanine and amino butyric acid (ABA)) in controlling copper (Cu) removal rates was investigated. The results are consistent with the known activity of –COOH groups at acidic conditions and that of –NH2 groups in an alkaline environment. In comparison with glycine, it was also observed that an increase in the carbon chain length increased the removal rates at acidic pH values and decreased the removal rates at alkaline pH values. Also, Cu removal rates decreased with an increase in the distance between the –NH2 and –COOH groups in an amino acid at all pH values except at 4.

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