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Microwave building as an application of wireless power transfer

Published online by Cambridge University Press:  21 March 2014

Naoki Shinohara*
Affiliation:
Research Institute for Sustainable Humanosphere, Kyoto University, Gokasho, Uji, Kyoto 6110011, Japan. Phone: +81 774 38 3807
Naoki Niwa
Affiliation:
Kajima Technical Research Institute, Kajima Corporation, Tobitakyu 2-19-1, Chofu, Tokyo 1820036, Japan
Kenji Takagi
Affiliation:
Kajima Technical Research Institute, Kajima Corporation, Tobitakyu 2-19-1, Chofu, Tokyo 1820036, Japan
Kenniti Hamamoto
Affiliation:
Kajima Technical Research Institute, Kajima Corporation, Tobitakyu 2-19-1, Chofu, Tokyo 1820036, Japan
Satoshi Ujigawa
Affiliation:
Kajima Technical Research Institute, Kajima Corporation, Tobitakyu 2-19-1, Chofu, Tokyo 1820036, Japan
Jing-Ping Ao
Affiliation:
Institute of Technology and Science, The University of Tokushima, Shinzo 2-24, Tokushima 7708501, Japan
Yasuo Ohno
Affiliation:
e-Devise Inc., Nijuyonken-Ichijo 4-1-10, Nishi, Sapporo 0630801, Japan
*
Corresponding author: N. Shinohara Email: shino@rish.kyoto-u.ac.jp

Abstract

We propose a wireless power distribution system (WPDS) operating at 2.45 GHz CW in buildings instead of wired power distribution in order to reduce the initial cost of the building. Required technologies for the WPDS are (a) low-cost and low-loss deck plate waveguide, (b) variable microwave power distributor for the waveguide, and (c) high-power (>100 W) rectifier at the outlet. We developed and tested the deck plate waveguide, power distributor, and high-power rectenna consisting of 256 Si Schottky barrier diodes and newly developed GaN diodes. Finally, a test WPDS was built and microwave power transmission experiments were conducted. The total efficiency of the test WPDS was estimated to be 52%.

Information

Type
Research Article
Copyright
Copyright © Cambridge University Press 2014 
Figure 0

Fig. 1. Concept of the WPDS for a building.

Figure 1

Fig. 2. Elevation and plane diagrams of the WPDS.

Figure 2

Fig. 3. Illustration and photograph of deck plate waveguide.

Figure 3

Fig. 4. Simulation result of the TE10 mode traversing a deck plate waveguide.

Figure 4

Table 1. Experimental results of power loss in a deck plate waveguide.

Figure 5

Fig. 5. (a) Photograph and (b) illustration of the developed power divider.

Figure 6

Fig. 6. Simulated and measured S11, S21, and S31 with x and m parameters.

Figure 7

Fig. 7. (a) Block diagram of the rectenna outlet, (b) detail of the microwave pick-up.

Figure 8

Fig. 8. Simulated S parameters for transmission from the deck plate to the coaxial pick-up.

Figure 9

Fig. 9. An illustration of the four pick-ups located on a 3-m deck plate waveguide.

Figure 10

Fig. 10. S parameters for each port shown in Fig. 9: (a) simulation and (b) measurement.

Figure 11

Fig. 11. Developed 64-divided high-power rectenna composed of 256 Si Schottky barrier diodes.

Figure 12

Fig. 12. RF–DC conversion efficiency of high-power rectenna in the case of 64-parallel connections and a load of 10 Ω.

Figure 13

Fig. 13. Rectenna outlet composed of a rectenna, a DC/DC converter and batteries.

Figure 14

Fig. 14. (a) Device structure of an n-GaN Schottky diode on an SI SiC substrate. (b) Photograph of fabricated diode with five anode fingers [9]. (c) Photograph of the GaN diodes.

Figure 15

Fig. 15. Breakdown characteristics of diodes under reverse bias [9].

Figure 16

Fig. 16. GaN diode rectifier of Vbr = 100 V and ten fingers: (a) illustration and (b) photograph.

Figure 17

Fig. 17. Measured RF–DC conversion efficiency of rectifier composed of a GaN diode.

Figure 18

Fig. 18. Final test setup: (a) frame, (b) deck plate waveguide, (c) concrete at floor, (d) power distributor, (e) final setup.