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DIFFERENTIAL RESPONSE OF WHEAT GENOTYPES TO HEAT STRESS DURING GRAIN FILLING

Published online by Cambridge University Press:  20 December 2018

PARIMALAN RANGAN
Affiliation:
Queensland Alliance for Agriculture and Food Innovation, University of Queensland, St Lucia QLD 4072, Australia Division of Genomic Resources, ICAR-National Bureau of Plant Genetic Resources, New Delhi 110012, India
AGNELO FURTADO
Affiliation:
Queensland Alliance for Agriculture and Food Innovation, University of Queensland, St Lucia QLD 4072, Australia
ROBERT HENRY*
Affiliation:
Queensland Alliance for Agriculture and Food Innovation, University of Queensland, St Lucia QLD 4072, Australia
*
§Corresponding author. Email: robert.henry@uq.edu.au
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Summary

Climatic change affects global agriculture and is a severe threat to global food security due to variability of the three factors measuring climate change (CO2, temperature and precipitation) with temperature being the most crucial one. Wheat is severely affected by high temperatures with reproductive and grain-filling phases being most sensitive, impacting grain number, size and weight. Seed size and weight are the key agronomic traits subjected to artificial selection and involved in the domestication process since the origin of agriculture. Three genotypes Banks, EGA Gregory and Fang-60 with the latter known to be heat tolerant were grown under glass house conditions and subjected to heat stress for 3 days during early- (11–14 dpa – days post anthesis) and late- (27–30 dpa) grain filling stages in a mutually exclusive fashion. The impact of heat stress during early- and late- grain filling on the four major grain characteristics, thousand grain weight (TGW), grain length, grain width and grain thickness was assessed. The tolerant genotype Fang-60 exhibited significantly higher TGW during early-grain filling heat stress than the control possibly due to an ability to exploit the accelerated release of fertilizer under high temperature. Banks and EGA Gregory were moderately tolerant to susceptible to heat stress, respectively, at early- and late-grain filling with Fang-60 being tolerant to both early- and late- grain filling heat stress. This study confirms the availability of significant genetic variation in heat stress response in wheat that might be exploited to adapt wheat to higher growth temperatures.

Information

Type
Research Article
Creative Commons
Creative Common License - CCCreative Common License - BY
This is an Open Access article, distributed under the terms of the Creative Commons Attribution licence (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted re-use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright
Copyright © Cambridge University Press 2018
Figure 0

Table 1. Effect of heat stress during early-(H1) and late-(H2) grain filling on thousand grain weight (TGW), grain length (GL), grain width (GW) and grain thickness (GT).

Figure 1

Table 2. Analysis of variance and partitioning for two factors (genotype and heat stress) at three levels each for thousand grain weight (TGW).

Figure 2

Table 3. Analysis of variance and partitioning for two factors (genotype and heat stress) at three levels each for grain length (GL).

Figure 3

Table 4. Analysis of variance and partitioning for two factors (genotype and heat stress) at three levels each for grain width (GW).

Figure 4

Table 5. Analysis of variance and partitioning for two factors (genotype and heat stress) at three levels each for grain thickness (GT).

Figure 5

Figure 1. Effect of heat stress during early- and late-grain filling on thousand grain weight (g) across the three genotypes with Fang-60 being stress tolerant. Error bars represent standard deviation. Capital letters above error bar compare treatment effect within a genotype (set of three bars C, H1 and H2 of a genotype are compared). Small letters above error bar compare between the genotypes of same treatment (same coloured bar across three genotypes are compared). X-axisC: control; H1: 11–14 dpa heat stress; H2: 27–30 dpa heat stress.