Hostname: page-component-77c78cf97d-cfh4f Total loading time: 0 Render date: 2026-04-24T05:03:22.747Z Has data issue: false hasContentIssue false
  • English
  • Français

Reactive ionized physical vapor deposition of thin films

Published online by Cambridge University Press:  28 October 2011

S. Konstantinidis  and
R. Snyders
S. Konstantinidis*
Affiliation:
Chimie des Interactions Plasma Surface, CIRMAP, Université de Mons, 20 Place du Parc, 7000 Mons, Belgium
R. Snyders
Affiliation:
Chimie des Interactions Plasma Surface, CIRMAP, Université de Mons, 20 Place du Parc, 7000 Mons, Belgium Materia Nova Research Center, Avenue N. Copernic 1, 7000 Mons, Belgium
*
ae-mail: stephanos.konstantinidis@umons.ac.be
Get access

Abstract

In this article, the experimental results obtained in our laboratory for the last 10 years and related to the reactive Ionized Physical Vapor Deposition (IPVD) processes are reviewed. Titanium oxide and titanium nitride thin films were chosen as case studies. The titanium-based thin films were synthesized from a pure titanium target sputtered in a mixture of argon and reactive gas (oxygen or nitrogen). Two IPVD processes were investigated namely (i) reactive magnetron sputtering amplified by a superimposed secondary inductively coupled plasma and (ii) reactive High-Power Impulse Magnetron Sputtering (HiPIMS). These researches were dedicated to the understanding of the plasma and plasma-surface interaction chemistries by using advanced plasma diagnostic techniques such as energy-resolved mass spectroscopy, time-resolved emission and absorption spectroscopy. The relationships between the plasma chemistry and energetics and the properties of the thin films are emphasized.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

Petrov, I., Adibi, F., Greene, J.E., Hultman, L., Sundgren, J.E., Appl. Phys. Lett. 63, 36 (1993)CrossRef
Petrov, I., Barna, P.B., Hultman, L., Greene, J.E., J. Vac. Sci. Technol. A 21, S117 (2003)CrossRef
Kelly, P.J., Arnell, R.D., Vacuum 56, 159 (2000)CrossRef
Catania, P., Roy, R.A., Cuomo, J.J., J. Appl. Phys. 74, 1008 (1993)CrossRef
Mounier, E., Pauleau, Y., Diam. Relat. Mater. 6, 1182 (1997)CrossRef
Windischmann, H., Crit. Rev. Solid State Mater. Sci. 17, 547 (1992)CrossRef
Houska, J., Warschkow, O., Bilek, M.M.M., McKenzie, D.R., Vlcek, J., Potocky, S., J. Phys. Condens. Matter 18, 2337 (2006)CrossRef
Oettel, H., Wiedemann, R., Preissler, S., Surf. Coat. Technol. 74–75, 273 (1995)CrossRef
Helmersson, U., Lattemann, M., Bohlmark, J., Ehiasarian, A.P., Gudmundsson, J.T., Thin Solid Films 513, 1 (2006)CrossRef
Sarakinos, K., Alami, J., Konstantinidis, S., Surf. Coat. Technol. 204, 1661 (2010)CrossRef
Alami, J., Eklund, P., Andersson, J.M., Lattemann, M., Wallin, E., Bohlmark, J., Persson, P., Helmersson, U., Thin Solid Films 515, 3434 (2007)CrossRef
Mraz, S., Schneider, J.M., J. Appl. Phys. 109 (2011)CrossRef
Mills, A., LeHunte, S., Photobiol. A: Chem. 108, 1 (1997)CrossRef
Martin, N., Rousselot, C., Rondot, D., Palmino, F., Mercier, R., Thin Solid Films 300, 113 (1997)CrossRef
Snyders, R., Dauchot, J.P., Hecq, M., Plasma Process. Polym. 4, 113 (2007)CrossRef
Konstantinidis, S., Nouvellon, C., Dauchot, J.P., Wautelet, M., Hecq, M., Surf. Coat. Technol. 174, 100 (2003)CrossRef
Konstantinidis, S., Ricard, A., Ganciu, M., Dauchot, J.P., Ranea, C., Hecq, M., J. Appl. Phys. 95, 2900 (2004)CrossRef
Konstantinidis, S., Ricard, A., Snyders, R., Vandeparre, H., Dauchot, J.P., Hecq, M., Surf. Coat. Technol. 200, 841 (2005)CrossRef
Nouvellon, C., Konstantinidis, S., Dauchot, J.P., Wautelet, M., Jouan, P.Y., Ricard, A., Hecq, M., J. Appl. Phys. 92, 32 (2002)CrossRef
Ricard, A., Nouvellon, C., Konstantinidis, S., Dauchot, J.P., Wautelet, M., Hecq, M., J. Vac. Sci. Technol. A: Vacuum Surfaces and Films 20, 1488 (2002)CrossRef
Ganciu, M., Konstantinidis, S., Paint, Y., Dauchot, J.P., Hecq, M., de Poucques, L., Vasina, P., Mesko, M., Imbert, J.-C., Bretagne, J., Touzeau, M., J. Optoelectron. Adv. Mater. 7, 2512 (2005)
Ganciu, M., Hecq, M., Dauchot, J.P., Konstantinidis, S., Bretagne, J., de Poucques, L., Touzeau, M., World Patent, 2004
Konstantinidis, S., Dauchot, J.P., Ganciu, M., Hecq, M., Appl. Phys. Lett. 88, 021501 (2006)CrossRef
Konstantinidis, S., Dauchot, J.P., Ganciu, M., Ricard, A., Hecq, M., J. Appl. Phys. 99, 013307 (2006)CrossRef
Konstantinidis, S., Dauchot, J.P., Hecq, A., Thin Solid Films 515, 1182 (2006)CrossRef
Nouvellon, C., Konstantinidis, S., Dauchot, J.P., Hecq, M., Vide Science Technique et Applications 57, 243 (2002)
Andrew, Y., Abraham, I., Booske, J.H., Lu, Z.C., Wendt, A.E., J. Appl. Phys. 88, 3208 (2000)CrossRef
de Poucques, L., Imbert, J.C., Vasina, P., Boisse-Laporte, C., Teule-Gay, L., Bretagne, J., Touzeau, M., Surf. Coat. Technol. 200, 800 (2005)CrossRef
Xu, L., Sadeghi, N., Donnelly, V.M., Economou, D.J., J. Appl. Phys. 101 (2007)
Snyders, R., Gouttebaron, R., Dauchot, J.P., Hecq, M., Surf. Coat. Technol. 200, 448 (2005)CrossRef
Lide, D.R. (ed.), Handbook of Chemistry and Physics, 87th edn. (CRC Press, Boca Raton, FL, 2006–2007)Google Scholar
Kim, J.N., Lee, H.Y., Lee, D.K., Lee, J.J., Surf. Coat. Technol. 201, 5442 (2007)CrossRef
Zeuner, M., Neumann, H., Meichsner, J., J. Appl. Phys. 81, 2985 (1997)CrossRef
Han, Y.H., Jung, S.J., Lee, J.J., Surf. Coat. Technol. 201, 5387 (2007)CrossRef
Li, Z.G., Miyake, S., Acta Metall. Sin. 46, 13 (2010)CrossRef
Chapman, B., Glow Discharge Processes (John Wiley & Sons, New York, 1981)Google Scholar
Ehiasarian, A.P., Vetushka, A., Hecimovic, A., Konstantinidis, S., J. Appl. Phys. 104, 83305 (2008)CrossRef
Konstantinidis, S., Hemberg, A., Dauchot, J.P., Hecq, M., J. Vac. Sci. Technol. B 25, L19 (2007)CrossRef
Leroy, W., Konstantinidis, S., Mahieu, S., Snyders, R., Depla, D., J. Phys. D: Appl. Phys. 44, 115201 (2011)CrossRef
Kersten, H., Deutsch, H., Steffen, H., Kroesen, G.M.W., Hippler, R., Vacuum 63, 385 (2001)CrossRef
Ehiasarian, A.P., Gonzalvo, Y.A., Whitmore, T.D., Plasma Process. Polym. 4, S309 (2007)CrossRef
Mraz, S., Schneider, J.M., Appl. Phys. Lett. 89, 051502 (2006)CrossRef
Mraz, S., Schneider, J.M., J. Appl. Phys. 100, 023503 (2006)CrossRef
Alami, J., Sarakinos, K., Uslu, F., Klever, C., Dukwen, J., Wuttig, M., J. Phys. D. Appl. Phys. 42, 115204 (2009)CrossRef
Lundin, D., Larsson, P., Wallin, E., Lattemann, M., Brenning, N., Helmersson, U., Plasma Sources Sci. Technol. 17, 035021 (2008)CrossRef
Sarakinos, K., Music, D., Mraz, S., Baben, M.T., Jiang, K., Nahif, F., Braun, A., Zilkens, C., Konstantinidis, S., Renaux, F., Cossement, D., Munnik, F., Schneider, J.M., J. Appl. Phys. 108, 014904 (2010)CrossRef