Kuan-Neng Chen
Guest Editor for this issue of MRS Bulletin
Department of Electronics Engineering, National Chiao Tung University, Taiwan; tel. 886-3-5712121 ext. 31558; and email knchen@mail.nctu.edu.tw.
Chen is a professor in the Department of Electronics Engineering at National Chiao Tung University, as well as a consultant for the Industrial Technology and Research Institute and adjunct research staff member at the National Chip Implementation Center. He received his PhD degree in electrical engineering and computer science and his MS degree in materials science and engineering, both from the Massachusetts Institute of Technology. He was a research staff member at the IBM T.J. Watson Research Center. He received the 2014 Outstanding Electrical Engineering Professor Award from the Chinese Institute of Electrical Engineers. His research interests include three-dimensional integrated circuits, heterogeneous integration, and advanced packaging technology.
King-Ning Tu
Guest Editor for this issue of MRS Bulletin
Department of Materials Science and Engineering, HSSEAS School of Engineering & Applied Sciences, University of California–Los Angeles, USA; tel. 310-206-4838; and email kntu@ucla.edu.
Tu is a distinguished professor in both the Department of Materials Science and Engineering and the Department of Electrical Engineering at the University of California–Los Angeles. He received a PhD degree in applied physics from Harvard University in 1968. He spent 25 years at the IBM T.J. Watson Research Center as a research staff member in the Physical Science Department. He received the 2013 John Bardeen Award of TMS and is an academician of Academia Sinica, Taiwan. He has recently authored a book (Kinetics in Nanoscale Materials), and his research interests include kinetic theories of interfacial reactions. He is a Fellow of the American Physical Society, The Minerals, Metals and Materials Society, and Materials Research Society (MRS), and was president of MRS in 1981.
Chih Chen
Department of Materials Science and Engineering, National Chiao Tung University, Taiwan; tel. +886-3573-1814; and email chih@mail.nctu.edu.tw.
Chen is a professor in the Department of Materials Science and Engineering at National Chiao Tung University. He received his PhD and master’s degrees in materials science at the University of California–Los Angeles. He received the 2007 Outstanding Young Researcher Award from the National Science Council of Taiwan and the 2013 Outstanding Young Researcher Award from the Academia Sinica, Taiwan. His current research interests include the reliabilities of flip-chip solder joints and microbumps for three-dimensional integrated circuits, fabrication and applications of nanotwinned Cu, and low-temperature Cu-to-Cu direct bonding.
Takafumi Fukushima
New Industry Creation Hatchery Center, Tohoku University, Japan; tel. 8122795 4119; and email fukushima@bmi.niche.tohoku.ac.jp.
Fukushima is an associate professor at the New Industry Creation Hatchery Center, Tohoku University. He received his PhD degree in synthetic chemistry from Yokohama National University, Japan, in 2003. From 2001 to 2003, he was a technical advisor with PI R&D Corporation, Japan. He worked for the Department of Bioengineering and Robotics, Tohoku University, as a research associate from 2004 to 2007 and as an assistant professor from 2007 to 2009. His research interests include three-dimensional large-scale integration, optical interconnection, retinal prosthesis, and the brain-implantable probe system, including polymeric studies. Among his awards are the Gottfried Wagener Prize (German Innovation Award) in 2010 and the IEEE ECTC Outstanding Session Paper Award in 2011.
Sam Gu
Qualcomm Technologies, Inc., CA, USA; tel. 858-845-8781; and email samgu@qti.qualcomm.com.
Gu is a principal manager at Qualcomm Technologies, Inc. and is responsible for three-dimensional and two-and-a-half-dimensional process technology integration. He received his BS degree from Nanjing University and his PhD degree in solid-state physics from the University of Utah. He has more than 20 years of experience in the semiconductor industry, specializing in process development, integration, and advanced memory IPs integration for next-generation wireless products. Prior to joining Qualcomm, he worked as a principal engineer at LSI Logic on semiconductor research, process development, and integration for application-specific integrated-circuit products. He also holds more than 40 US patents for inventions.
Paul S. Ho
Texas Materials Institute, The University of Texas at Austin, USA; tel. 512-471-8961; and email hops@austin.utexas.edu.
Ho is the Cockrell Family Regents Chair in Materials Science and Engineering and the director of the Laboratory for Interconnect and Packaging at The University of Texas at Austin. He received his PhD degree in physics from Rensselaer Polytechnic Institute. He joined the Department of Materials Science and Engineering at Cornell University in 1966 and became an associate professor in 1972. In 1972, he joined the IBM T.J. Watson Research Center and became the senior manager of the Interface Science Department in 1985. In 1991, he joined the faculty at The University of Texas at Austin. His current research includes materials and processing science for interconnect and packaging applications. He is a Fellow of the American Physical Society, the American Vacuum Society, and the Institute of Electrical and Electronics Engineers.
Rui Huang
The University of Texas at Austin, USA; tel. 512-471-7558; and email ruihuang@mail.utexas.edu.
Huang is a professor of aerospace engineering and engineering mechanics and holds the endowed position of the Pearlie Dashiell Henderson Centennial Fellowship in Engineering at The University of Texas at Austin, where he has been since 2002. He received his BS degree in theoretical and applied mechanics from the University of Science and Technology of China in 1994 and his PhD degree in civil and environmental engineering, specializing in mechanics, materials, and structures, from Princeton University in 2001. His research interests include mechanics of integrated materials and structures at micro- and nanoscales, reliability of advanced interconnects and packaging for microelectronics, and mechanical instability of thin films and nanostructures.
Jay Im
The University of Texas at Austin, USA; tel. 512-471-9858; and email jayim@mail.utexas.edu.
Im is a research professor at the Laboratory for Interconnect and Packaging, The University of Texas at Austin. He received his BS degree in mechanical engineering in 1964 from Seoul National University, Korea. He received his MS degree in mechanical engineering in 1971 and his ScD degree in 1976 in materials science and engineering from the Massachusetts Institute of Technology. Up until 2004, he was with The Dow Chemical Company for 28 years, taking on various research and development positions, including research scientist in electronic materials. He headed materials science and adhesion efforts for bisbenzocylobutene and SiLK dielectrics. He has published over 140 papers and holds nine US patents.
Subramanian S. Iyer
Microelectronics Division, IBM Systems and Technology Group, USA; tel. 845 894 1439; and email ssiyer@us.ibm.com.
Iyer is the director of System Scaling Technology at IBM, is an IBM Fellow, a member of the IBM Academy of Technology, and a master inventor at IBM Microelectronics. He earned his Bachelor of Technology degree from the Indian Institute of Technology Bombay and his PhD degree from the University of California–Los Angeles. He has published over 250 papers and holds over 70 patents. He is an Institute of Electrical and Electronics Engineers (IEEE) Fellow, a Distinguished Lecturer of the IEEE Electron Devices Society, and a member of its Board of Governors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for Emerging Technologies in 2012.
Tengfei Jiang
Microelectronics Research Center, The University of Texas at Austin, USA.
Jiang received her BS degree in materials science and engineering from Tsinghua University, China, in 2006 and her MS degree in materials science and engineering from The Ohio State University, in 2009. She joined the PhD program of materials science and engineering at The University of Texas at Austin in 2010. Currently, her research focuses on materials and process related reliability issues in advanced microelectronic technologies, including three-dimensional integrated circuits. She is the recipient of the 2013–2014 Harrington Dissertation Fellowship, the highest award The University of Texas at Austin offers to continuing graduate students.
Mitsumasa Koyanagi
Tohoku University, Japan; tel. +81-22-795-6906; and email koyanagi@bmi.niche.tohoku.ac.jp.
Koyanagi has been a professor at Tohoku University since 1994. He received his PhD degree from Tohoku University in 1974 and joined Hitachi Central Research Laboratory in 1974, where he invented the three-dimensional (3D)-stacked capacitor dynamic random-access memory cell. He joined the Xerox Palo Alto Research Center in 1985 and Hiroshima University in 1988. His interests include 3D integration technology, optical interconnection, nano-CMOS devices, memory devices, parallel computer systems, retinal prosthesis chips, and brain-machine interface devices. He is an Institute of Electrical and Electronics Engineers (IEEE) Fellow, and among his awards are the IEEE Jun-ichi Nishizawa Medal in 2006, the IEEE Cledo Brunetti Award in 1996, and the National Medal with Purple Ribbon in Japan in 2011.
Kang-Wook Lee
New Industry Creation Hatchery Center, Tohoku University, Japan; tel. 81227954119; and email kriss@bmi.niche.tohoku.ac.jp.
Lee is a professor at the New Industry Creation Hatchery Center, Tohoku University and is an Institute of Electrical and Electronics Engineers senior member. He received his PhD degree in machine intelligence and systems engineering from Tohoku University in 2000. From 2001 to 2002, he was a postdoctoral researcher at Rensselaer Polytechnic Institute, USA. He joined Samsung Electronics Ltd. as a principal engineer in 2002, where he led the research and development of through-silicon via-based three-dimensional (3D) stacking technology. In 2008, he joined Tohoku University’s Department of Bioengineering and Robotics. His current interests include 3D hybrid hetero-integrated large-scale integration, microelectromechanical systems, optoelectronic integrated systems, retinal prosthesis, and brain-machine interface devices.
Tetsu Tanaka
Tohoku University, Japan; tel. 81227956978; and email ttanaka@lbc.mech.tohoku.ac.jp.
Tanaka is a professor at Tohoku University’s Graduate School of Biomedical Engineering. He received BS (1987) and MS (1990) degrees in electronic engineering and his PhD degree (2003) in machine intelligence and systems engineering from Tohoku University. He joined Fujitsu Laboratories Ltd. in 1990, and from 1994 to 1995, he was a visiting Fellow at the University of California–Berkeley. In 2005, he became an associate professor at Tohoku University. He is working on fully implantable retinal prosthesis, intelligent Si neural probe, brain-machine interface devices, three-dimensional large-scale integrations, and nano-CMOS devices. He is a member of the Institute of Electrical and Electronics Engineers (IEEE) in Medicine and Biology Society, the IEEE Electron Devices Society, and the IEEE Solid-State Circuits Society.
Doug Yu
Taiwan Semiconductor Manufacturing Company, Taiwan; email chyu@tsmc.com.
Yu received his PhD degree from Georgia Tech and is an Institute of Electrical and Electronics Engineers Engineering Fellow and a senior director of the Taiwan Semiconductor Manufacturing Company. He is in charge of backend research and development, innovating Wellstar International technologies, including CoWoSTM, InFO, and UFI for two/three-dimensional system integration, which influences the semiconductor manufacturing landscape. He holds more than 470 US patents.
