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Focused Ion Beam Milling and Micromanipulation Lift-Out for Site Specific Cross-Section Tem Specimen Preparation

Published online by Cambridge University Press:  10 February 2011

L. A. Giannuzzi ,
J. L. Drown ,
S. R. Brown ,
R. B. Irwin  and
F. A. Stevie
L. A. Giannuzzi
Affiliation:
Department of Mechanical, Materials, and Aerospace Engineering, University of Central Florida, PO Box 162450, 4000 Central Florida Blvd., Orlando, FL 32816-2450
J. L. Drown
Affiliation:
Department of Mechanical, Materials, and Aerospace Engineering, University of Central Florida, PO Box 162450, 4000 Central Florida Blvd., Orlando, FL 32816-2450
S. R. Brown
Affiliation:
Kirk Resources, 9333 S. John Young Parkway, Orlando, FL 32819
R. B. Irwin
Affiliation:
Cirent Semiconductor, 9333 S. John Young Parkway, Orlando, FL 32819
F. A. Stevie
Affiliation:
Cirent Semiconductor, 9333 S. John Young Parkway, Orlando, FL 32819
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Abstract

A site specific technique for cross-section transmission electron microscopy specimen preparation of difficult materials is presented. Focused ion beams are used to slice an electron transparent sliver of the specimen from a specific area of interest. Micromanipulation lift-out procedures are then used to transport the electron transparent specimen to a carbon coated copper grid for subsequent TEM analysis. The experimental procedures are described in detail and an example of the lift-out technique is presented.

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