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Analysis and design of weak coupling coupler based on the half mode substrate integrated waveguide

Published online by Cambridge University Press:  20 March 2023

Minghui You Open the ORCID record for Minghui You [Opens in a new window] ,
Guohua Liu  and
Zhiqun Cheng
Minghui You
Affiliation:
School of Electronic and Information Engineering, Hangzhou Dianzi University, Hangzhou, 310018, China
Guohua Liu*
Affiliation:
School of Electronic and Information Engineering, Hangzhou Dianzi University, Hangzhou, 310018, China
Zhiqun Cheng
Affiliation:
School of Electronic and Information Engineering, Hangzhou Dianzi University, Hangzhou, 310018, China
*
Author for correspondence: Guohua Liu, E-mail: ghliu@hdu.edu.cn
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Abstract

Substrate integrated waveguide (SIW) technology represents a good solution for the design of couplers. Coupler structures proposed in most relevant reports cannot achieve excellent performance in the case of weak coupling. This work proposes a new weak coupling coupler architecture, similar to the branch line coupler. The metal via arrays is used to reshape the electric field distribution of the SIW structure, making the overall structure achieve weak coupling characteristics. The even-odd mode decomposition method analyzes this structure's equivalent transmission line model. For this purpose, a systematic design procedure is deployed to achieve several coupling values over a wide frequency bandwidth. A novel half-mode substrate integrated waveguide (HMSIW) coupler with a 29 dB coupling is designed and fabricated for verification based on the proposed method. Good agreements between the calculated and simulated results are observed. The proposed coupler has the advantage of high directivity within the broadband and can be used for SIW-based circuits and power detection in the Ku-band.

Keywords

Substrate integrated waveguideWeak coupling couplerEven-odd modeKu-band
Type
Passive Components and Circuits
Information
International Journal of Microwave and Wireless Technologies , Volume 15 , Issue 5 , June 2023 , pp. 734 - 741
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Copyright
© The Author(s), 2023. Published by Cambridge University Press in association with the European Microwave Association

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