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Digital PA with voltage-mode topology using envelope delta-sigma modulation

Published online by Cambridge University Press:  09 July 2013

Andreas Wentzel ,
Shinichi Hori ,
Makoto Hayakawa ,
Kazuaki Kunihiro  and
Wolfgang Heinrich
Andreas Wentzel*
Affiliation:
Ferdinand-Braun-Institut (FBH), Leibniz-Institut für Hoechstfrequenztechnik, 12489 Berlin, Germany. Phone: +49 30 6392 2627
Shinichi Hori
Affiliation:
NEC Corporation, Kawasaki, Kanagawa 211-8666, Japan
Makoto Hayakawa
Affiliation:
NEC Corporation, Kawasaki, Kanagawa 211-8666, Japan
Kazuaki Kunihiro
Affiliation:
NEC Corporation, Kawasaki, Kanagawa 211-8666, Japan
Wolfgang Heinrich
Affiliation:
Ferdinand-Braun-Institut (FBH), Leibniz-Institut für Hoechstfrequenztechnik, 12489 Berlin, Germany. Phone: +49 30 6392 2627
*
Corresponding author: A. Wentzel Email: andreas.wentzel@fbh-berlin.de
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Abstract

This paper reports on digital transmitter architecture for the 450 MHz band using an envelope delta-sigma modulator realized in CMOS and a voltage-mode class-S (VMCS) power amplifier (PA) based on GaN monolithic microwave integrated circuits (MMICs). The class-S PA is characterized for narrowband single-tone signals and a single- as well as a four-carrier downlink wideband code division multiple access (WCDMA) signal with a peak-to-average power ratio of 7.5 dB. Using single-tone excitation the PA shows a maximum drain efficiency of 86% and a peak output power of 4.4 W. At 6 and 10 dB back-off, 59 and 36% efficiency are achieved, respectively. With the single- and four-carrier WCDMA input signals maximum drain efficiencies of 64 and 53% are reached, respectively, and peak output power is 0.7 W. The adjacent channel leakage ratio shows values of about −34 dBc (5 MHz) and −38 dBc (10 MHz) for single-carrier WCDMA excitation. This is the first complete VMCS PA chain characterized with standard communication signals.

Keywords

Microwave power amplifierClass-SVoltage-modeEnvelope delta-sigmaModulationGaNMMIC
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 5 , Special Issue 3: European Microwave Week 2012 , June 2013 , pp. 285 - 292
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2013 

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