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Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches

  • Christophe Calvez (a1), Romain Pilard (a2), Christian Person (a1), Jean-Philippe Coupez (a1), François Gallée (a1), Frédéric Gianesello (a2), Hilal Ezzeddine (a3) and Daniel Gloria (a2)...

Abstract

Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a “lens”, allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.

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Corresponding author

Corresponding authors: C. Calvez and R. Pilard Emails: christophe.calvez@telecom-bretagne.eu, romain.pilard@st.com

References

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Keywords

Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches

  • Christophe Calvez (a1), Romain Pilard (a2), Christian Person (a1), Jean-Philippe Coupez (a1), François Gallée (a1), Frédéric Gianesello (a2), Hilal Ezzeddine (a3) and Daniel Gloria (a2)...

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