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Development of a Seebeck coefficient Standard Reference Material™

Published online by Cambridge University Press:  21 July 2011

Nathan D. Lowhorn ,
Winnie Wong-Ng ,
Zhan-Qian Lu ,
Joshua Martin ,
Martin L. Green ,
John E. Bonevich ,
Evan L. Thomas ,
Neil R. Dilley  and
Jeff Sharp
Nathan D. Lowhorn
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Winnie Wong-Ng*
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Zhan-Qian Lu
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Joshua Martin
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Martin L. Green
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
John E. Bonevich
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Evan L. Thomas
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Neil R. Dilley
Affiliation:
Quantum Design, Inc., San Diego, California 92126
Jeff Sharp
Affiliation:
Marlow Industries, Inc., Dallas, Texas 75238
*
a)Address all correspondence to this author. e-mail: winnie.wong-ng@nist.gov
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Abstract

We have successfully developed a Seebeck coefficient Standard Reference Material (SRM™), Bi2Te3, that is essential for interlaboratory data comparison and for instrument calibration. Certification measurements were performed using a differential steady-state technique on 10 samples (15 measurements) randomly selected from a batch of 390 bars. The certified Seebeck coefficient values are provided from 10 to 390 K, and they are further supported by transient measurements. The availability of this SRM will validate measurement results, leading to a better understanding of the structure/property relationships and underlying physics of potential high-efficiency thermoelectric materials.

Keywords

Electrical propertiesThermoelectricThermal conductivity

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Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 15: Focus Issue: Advances in Thermoelectric Materials , 14 August 2011 , pp. 1983 - 1992
Copyright
Copyright © Materials Research Society 2011

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