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Entrapment of organosilicon molecules in nonhydrolytic alumina gels and thermal behavior of the resulting composite

Published online by Cambridge University Press:  31 January 2011

G. S. Grader ,
S. A. Melchior ,
Y. De-Hazan ,
S. Melamed  and
G. E. Shter
G. S. Grader
Affiliation:
Chemical Engineering Department, Technion, Haifa 32000, Israel
S. A. Melchior
Affiliation:
Chemical Engineering Department, Technion, Haifa 32000, Israel
Y. De-Hazan
Affiliation:
Chemical Engineering Department, Technion, Haifa 32000, Israel
S. Melamed
Affiliation:
Chemical Engineering Department, Technion, Haifa 32000, Israel
G. E. Shter
Affiliation:
Chemical Engineering Department, Technion, Haifa 32000, Israel
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Abstract

This work describes the entrapment of tetrakis(trimethylsilyl)silane (TK) and tetrakis(chlorodimethylsilyl)silane (TKCl) in nonhydrolytic alumina gels, and the materials' thermal behavior. During gelation and drying TK and TKCl are physically entrapped in the gel up to a limit of Si/Al = 0.33. Above this limit, sublimation and decomposition of TK and TKCl occur during heating. A larger fraction of TKCl decomposition products is retained due to their higher reactivity. Below and above Si/Al = 0.33, the gel converts to mullite + α−Al2O3or mullite + amorphous silica, respectively. Conversion to hexagonal mullite indicates atomic scale homogeneity of Si and Al during firing.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 5 , May 2001 , pp. 1413 - 1419
Copyright
Copyright © Materials Research Society 2001

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References

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