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Influence of dealloying solution on the microstructure of nanoporous copper through chemical dealloying of Al75Cu25 ribbons

Published online by Cambridge University Press:  20 April 2020

Hailan Ma ,
Bingge Zhao Open the ORCID record for Bingge Zhao [Opens in a new window] ,
Kai Ding ,
Yuanheng Zhang ,
Guanzhi Wu  and
Yulai Gao Open the ORCID record for Yulai Gao [Opens in a new window]
Hailan Ma
Affiliation:
Center for Advanced Solidification Technology (CAST), School of Materials Science and Engineering, Shanghai University, Shanghai 200444, People's Republic of China
Bingge Zhao*
Affiliation:
Center for Advanced Solidification Technology (CAST), School of Materials Science and Engineering, Shanghai University, Shanghai 200444, People's Republic of China
Kai Ding
Affiliation:
Center for Advanced Solidification Technology (CAST), School of Materials Science and Engineering, Shanghai University, Shanghai 200444, People's Republic of China
Yuanheng Zhang
Affiliation:
Center for Advanced Solidification Technology (CAST), School of Materials Science and Engineering, Shanghai University, Shanghai 200444, People's Republic of China
Guanzhi Wu
Affiliation:
Center for Advanced Solidification Technology (CAST), School of Materials Science and Engineering, Shanghai University, Shanghai 200444, People's Republic of China
Yulai Gao*
Affiliation:
Center for Advanced Solidification Technology (CAST), School of Materials Science and Engineering, Shanghai University, Shanghai 200444, People's Republic of China
*
a)Address all correspondence to these authors. e-mail: binggezhao@shu.edu.cn
b)e-mail: ylgao@shu.edu.cn
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Abstract

In this article, Al75Cu25 (at.%) ribbons were dealloyed by HCl, H2C2O4, H3PO4, and NaOH solutions, respectively, to prepare nanoporous copper (NPC). The dealloying behavior is varied with dealloying solutions, allowing modulating the microstructure and porosity of the NPC. Al75Cu25 ribbons are fully dealloyed in HCl, H2C2O4, and NaOH solutions, whereas they are partially dealloyed in H3PO4 solution. Except the NPC prepared in the NaOH solution, no obvious cracks are traced in other samples. The surface diffusivity (Ds) of Cu atoms along the alloy/solution interfaces is varied with solutions, producing the NPC with different microstructure. NPC with higher specific surface area can be obtained by dealloying the Al75Cu25 ribbons in the HCl solution. Compared with the dealloying in H2C2O4, H3PO4, and NaOH solutions, the dealloying in 10 wt% HCl solution for 25 min at 90 ± 1 °C facilitates the best NPC in this work.

Keywords

Alalloyporosity

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Type
Article
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Journal of Materials Research , Volume 35 , Issue 19: Focus Issue: Porous Metals: From Nano to Macro , 14 October 2020 , pp. 2610 - 2619
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Copyright © Materials Research Society 2020

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References

Overbury, S.H., Ortiz-Soto, L., Zhu, H.G., Lee, B., Amiridis, M.D., and Sheng, D.: Comparison of Au catalysts supported on mesoporous titania and silica: Investigation of Au particle size effects and metal-support interactions. Catal. Lett. 95, 99 (2004).CrossRefGoogle Scholar
Gao, J.J., Zhou, G.P., Qiu, H.J., Wang, Y., and Wang, J.Q.: Dealloying monolithic Pt–Cu alloy to wire-like nanoporous structure for electrocatalysis and electrochemical sensing. Corros. Sci. 108, 194 (2016).CrossRefGoogle Scholar
Zhang, W.C., Wu, X.L., Kan, C.X., Pan, F.M., Chen, H.T., Zhu, J., and Chu, P.K.: Surface-enhanced Raman scattering from silver nanostructures with different morphologies. Appl. Phys. A 100, 83 (2010).CrossRefGoogle Scholar
Li, R., Liu, X.J., Wang, H., Wu, Y., Chu, X.M., and Lu, Z.P.: Nanoporous silver with tunable pore characteristics and superior surface enhanced Raman scattering. Corros. Sci. 84, 159 (2014).CrossRefGoogle Scholar
Zhang, S.C., Xing, Y.L., Jiang, T., Du, Z.J., Li, F., He, L., and Liu, W.B.: A three-dimensional tin-coated nanoporous copper for lithium-ion battery anodes. J. Power Sources 196, 6915 (2011).CrossRefGoogle Scholar
Rebbecchi, T.A. and Chen, Y.: Template-based fabrication of nanoporous metals. J. Mater. Res. 33, 2 (2017).CrossRefGoogle Scholar
Luo, H., Sun, L., Lu, Y., and Yan, Y.: Electrodeposition of mesoporous semimetal and magnetic metal films from lyotropic liquid crystalline phases. Langmuir 20, 10218 (2004).CrossRefGoogle ScholarPubMed
Peng, J., Cizeron, J., Bertone, J.F., and Colvin, V.L.: Preparation of macroporous metal films from colloidal crystals. J. Am. Chem. Soc. 121, 226 (1999).Google Scholar
Min, U.S. and Li, J.C.M.: The microstructure and dealloying kinetics of a Cu–Mn alloy. J. Mater. Res. 9, 2878 (1994).CrossRefGoogle Scholar
Zhang, F.M., Li, P., Yu, J., Wang, L.L., Saba, F., Dai, G., and He, S.Y.: Fabrication, formation mechanism and properties of three-dimensional nanoporous titanium dealloyed in metallic powders. J. Mater. Res. 32, 1528 (2017).CrossRefGoogle Scholar
Erlebacher, J., Karma, A., Dimitrov, N., and Sieradzki, K.: Evolution of nanoporosity in dealloying. Nature 410, 450 (2001).CrossRefGoogle ScholarPubMed
Pugh, D.V., Dursun, A., and Corcoran, S.G.: Formation of nanoporous platinum by selective dissolution of Cu from Cu0.75Pt0.25. J. Mater. Res. 18, 216 (2003).CrossRefGoogle Scholar
Hodge, A.M., Biener, J., Hsiung, L.L., Wang, Y.M., Hamza, A.V., and Satcher, J.H.: Monolithic nanocrystalline Au fabricated by the compaction of nanoscale foam. J. Mater. Res. 20, 554 (2005).CrossRefGoogle Scholar
Chen, W., Karen, Y.C., Wang, S., McNulty, I., and Dunand, D.C.: Effect of Ag–Au composition and acid concentration on dealloying front velocity and cracking during nanoporous gold formation. Acta Mater. 61, 5561 (2013).CrossRefGoogle Scholar
Kong, Q.Q., Wei, F., Sun, C.H., Ying, L., and Lian, L.X.: Controllable fabrication of bulk hierarchical nanoporous palladium by chemical dealloying at various temperature and its thermal coarsening. J. Porous Mater. 25, 555 (2018).CrossRefGoogle Scholar
Song, T.T., Gao, Y.L., Zhang, Z.H., and Zhai, Q.J.: Dealloying behavior of rapidly solidified Al–Ag alloys to prepare nanoporous Ag in inorganic and organic acidic media. CrystEngComm 13, 7058 (2011).CrossRefGoogle Scholar
Zhang, C., Sun, J.Z., Xu, J.L., Wang, X.G., Ji, H., Zhao, C.C., and Zhang, Z.H.: Formation and microstructure of nanoporous silver by dealloying rapidly solidified Zn–Ag alloys. Electrochim. Acta 63, 302 (2012).CrossRefGoogle Scholar
Tuan, N.T., Park, J., Lee, J., Gwak, J., and Lee, D.: Synthesis of nanoporous Cu films by dealloying of electrochemically deposited Cu–Zn alloy films. Corros. Sci. 80, 7 (2014).CrossRefGoogle Scholar
Tang, Y., Liu, Y., Lian, L.X., Zhou, X.Z., and He, L.: Formation of nanoporous copper through dealloying of dual-phase Cu–Mn–Al alloy: The evolution of microstructure and composition. J. Mater. Res. 27, 2771 (2012).CrossRefGoogle Scholar
Okayasu, M., Sato, R., and Takasu, S.: Effects of anisotropic microstructure of continuous cast Al–Cu eutectic alloys on their fatigue and tensile properties. Int. J. Fatigue 42, 45 (2012).CrossRefGoogle Scholar
Zhao, B.G., Jia, S., Yuan, Y.L., Song, T.T., Ma, H.L., Zhai, Q.J., and Gao, Y.L.: Paving the way to Fe3O4 nano- and microoctahedra by dealloying Al–Fe binary alloys. Mater. Charact. 156, 109869 (2019).CrossRefGoogle Scholar
Wang, X.G., Qi, Z., Zhao, C.C., Wang, W.M., and Zhang, Z.H.: Influence of alloy composition and dealloying solution on the formation and microstructure of monolithic nanoporous silver through chemical dealloying of Al–Ag alloys. J. Phys. Chem. C 113, 13139 (2009).CrossRefGoogle Scholar
Liu, W.B., Chen, L., Yan, J.Z., Li, N., Shi, S.Q., and Zhang, S.C.: Dealloying solution dependence of fabrication, microstructure and porosity of hierarchical structured nanoporous copper ribbons. Corros. Sci. 94, 114 (2015).CrossRefGoogle Scholar
Liu, W.B., Zhang, S.C., Li, N., Zheng, J.W., An, S.S., and Li, G.X.: Influence of dealloying solution on the microstructure of monolithic nanoporous copper through chemical dealloying of Al–30 at.% Cu alloy. Int. J. Electrochem. Sci. 7, 7993 (2012).Google Scholar
Zhang, Z.H., Wang, Y., Qi, Z., Zhang, W.H., Qin, J.Y., and Frenzel, J.: Generalized fabrication of nanoporous metals (Au, Pd, Pt, Ag, and Cu) through chemical dealloying. J. Phys. Chem. C 113, 12629 (2009).CrossRefGoogle Scholar
Qi, Z., Zhao, C.C., Wang, X.G., Lin, J.K., Shao, W., Zhang, Z.H., and Bian, X.F.: Formation and characterization of monolithic nanoporous copper by chemical dealloying of Al–Cu alloys. J. Phys. Chem. C 113, 6694 (2009).CrossRefGoogle Scholar
Wang, Z.B., Wang, Y., Gao, H., Niu, J.Z., Zhang, J., Peng, Z.Q., and Zhang, Z.H.: ‘Painting’ nanostructured metals-playing with liquid metal. Nanoscale Horiz. 3, 408 (2018).CrossRefGoogle ScholarPubMed
Xing, Y.L., Wang, S.B., Fang, B.Z., Zhang, S.C., and Liu, W.B.: Structure evolution of nanoporous copper by dealloying of Al 17–33 at.% Cu alloy. Int. J. Electrochem. Sci. 10, 4849 (2015).Google Scholar
Chen, F., Chen, X., Zou, L.J., Yao, Y., Lin, Y.J., Shen, Q., Lavernia, E.J., and Zhang, L.M.: Fabrication and mechanical behavior of bulk nanoporous Cu via chemical de-alloying of Cu–Al alloys. Mater. Sci. Eng., A 660, 241 (2016).CrossRefGoogle Scholar
Kurz, W. and Trivedi, R.: Rapid solidification processing and microstructure formation. Mater. Sci. Eng., A 179–180, 46 (1994).CrossRefGoogle Scholar
Ye, S. and Balk, T.J.: Evolution of structure, composition, and stress in nanoporous gold thin films with grain-boundary cracks. Metall. Mater. Trans. A 39, 2656 (2008).Google Scholar
Senior, N.A. and Newman, R.C.: Synthesis of tough nanoporous metals by controlled electrolytic dealloying. Nanotechnology 17, 2311 (2006).CrossRefGoogle Scholar
An, S.S., Zhang, S.C., Liu, W.B., Fang, H., Zhang, M.L., and Yu, Y.: Dealloying behavior of Mn–30Cu alloy in acetic acid solution. Corros. Sci. 75, 256 (2013).CrossRefGoogle Scholar
Hakamada, M. and Mabuchi, M.: Nanoporous gold prism microassembly through a self-organizing route. Nano Lett. 6, 882 (2006).CrossRefGoogle ScholarPubMed
Hakamada, M. and Mabuchi, M.: Microstructural evolution in nanoporous gold by thermal and acid treatments. Mater. Lett. 62, 483 (2008).CrossRefGoogle Scholar
Newman, R.C. and Sieradzki, K.: Metallic corrosion. Science 263, 1708 (1994).CrossRefGoogle ScholarPubMed
Zhang, Q., Wang, X.G., Qi, Z., Wang, Y., and Zhang, Z.H.: A benign route to fabricate nanoporous gold through electrochemical dealloying of Al–Au alloys in a neutral solution. Electrochim. Acta 54, 6190 (2009).CrossRefGoogle Scholar
Moshier, W.C., Davis, G.D., and Ahearn, J.S.: The corrosion and passivity of aluminum exposed to dilute sodium sulfate solutions. Corros. Sci. 27, 785 (1987).CrossRefGoogle Scholar
Ding, Y., Kim, Y.J., and Erlebacher, J.: Nanoporous gold leaf: “ancient technology”/advanced material. Adv. Mater. 16, 1897 (2010).CrossRefGoogle Scholar
Li, X.Q., Huang, B.S., Qiu, C.C., Li, Z., Shao, L.H., and Liu, H.: Hierarchical nested-network porous copper fabricated by one-step dealloying for glucose sensing. J. Alloys Compd. 681, 109 (2016).CrossRefGoogle Scholar
Liu, W.B., Chen, L., Yan, J.Z., Li, N., Shi, S.Q., and Zhang, S.C.: Nanoporous copper from dual-phase alloy families and its technology application in lithium ion batteries. Corros. Rev. 33, 203 (2015).CrossRefGoogle Scholar
Diao, F.Y., Xiao, X.X., Luo, B., Sun, H., Ding, F., Ci, L.J., and Si, P.C.: Two-step fabrication of nanoporous copper films with tunable morphology for SERS application. Appl. Surf. Sci. 427, 1271 (2018).CrossRefGoogle Scholar
Sieradzki, K., Corderman, R.R., Shukla, K., and Newman, R.C.: Computer simulations of corrosion: Selective dissolution of binary alloys. Philos. Mag. A 59, 713 (1989).CrossRefGoogle Scholar
Qian, L.H. and Chen, M.W.: Ultrafine nanoporous gold by low-temperature dealloying and kinetics of nanopore formation. Appl. Phys. Lett. 91, 597 (2007).CrossRefGoogle Scholar