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Residual stress in ceramics with large thermal expansion anisotropy

Published online by Cambridge University Press:  31 January 2011

S. W. Paulik
Affiliation:
Department of Materials Science and Engineering, Robert R. McCormick School of Engineering and Applied Science, Northwestern University, Evanston, Illinois 60208–3108
M. H. Zimmerman
Affiliation:
Department of Materials Science and Engineering, Robert R. McCormick School of Engineering and Applied Science, Northwestern University, Evanston, Illinois 60208–3108
K. T. Faber
Affiliation:
Department of Materials Science and Engineering, Robert R. McCormick School of Engineering and Applied Science, Northwestern University, Evanston, Illinois 60208–3108
E. R. Fuller Jr.
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
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Abstract

Residual stress was measured in sintered and heat-treated Fe2TiO5 samples with various grain sizes. The influence of texturing was assessed by comparing the residual stress states of samples having randomly oriented grains and highly oriented grains produced through magnetically assisted processing. The residual stress was measured with x-ray diffraction using Cr Kα radiation. Due to the significant texture and the consequential oscillations in the dφψ vs sin2ψ data, the residual stress was calculated using the Marion–Cohen method. Textured samples showed significantly lower residual stresses except when spontaneous microcracking accompanied grain growth in the randomly oriented systems. Elastic modulus measurements showed a direct correlation between the decrease in residual stress and the microcrack density.

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Articles
Copyright
Copyright © Materials Research Society 1996

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