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Analysis of Phase Transformation Kinetics by Intrinsic Stress Evolutions During the Isothermal Aging of Amorphous Ni(P) and Sn/Ni(P) Films

Published online by Cambridge University Press:  03 March 2011

J.Y. Song ,
Jin Yu  and
T.Y. Lee
J.Y. Song
Affiliation:
Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701, Korea
Jin Yu*
Affiliation:
Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701, Korea
T.Y. Lee
Affiliation:
Department of Materials Engineering, Hanbat National University, San 16-1 Dukmyung-dong, Yuseong-gu, Daejeon 305-719, Korea
*
a)Address all correspondence to this author. e-mail: jinyu@kaist.ac.kr
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Abstract

The kinetics for the crystallization of amorphous Ni(P) films and the formation of intermetallic compounds in Sn/Ni(P) films during isothermal aging treatment were studied with in situ intrinsic stress measurements. The intrinsic stress changes from crystallization were about 200 and 150 MPa for Ni(14P) and Ni(11.7P) films, respectively, and according to Johnson–Mehl–Avrami analysis, the Avrami exponents were about 3.6 ± 0.46 and 4.2 ± 0.39, and the activation energies were 242 and240 kJ/mol, respectively, for the crystallization of Ni(14P) and Ni(11.7P) films. The stress due to the formation of intermetallic compounds such as Ni3Sn4 and Ni3P in Sn/Ni(11.7P) films was about 320 MPa. Application of in situ stress measurementsto the empirical growth model during isothermal phase transformation of Sn/Ni(P) showed that the intermetallic compounds growth was interface reaction-controlled (n = 0.91 ± 0.08) in the early stage and then became diffusion-controlled (n =0.38 ± 0.01), and the activation energy was about 35.9 kJ/mol.

Keywords

Phase transformation kineticsIntrinsic stressDiffusion
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 4 , April 2004 , pp. 1257 - 1264
Copyright
Copyright © Materials Research Society 2004

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