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Determining the elastic modulus and hardness of an ultra-thin film on a substrate using nanoindentation

  • Han Li (a1) and Joost J. Vlassak (a1)

Abstract

A data analysis procedure has been developed to estimate the contact area in an elasto-plastic indentation of a thin film bonded to a substrate. The procedure can be used to derive the elastic modulus and hardness of the film from the indentation load, displacement, and contact stiffness data at indentation depths that are a significant fraction of the film thickness. The analysis is based on Yu's elastic solution for the contact of a rigid conical punch on a layered half-space and uses an approach similar to the Oliver-Pharr method for bulk materials. The methodology is demonstrated for both compliant films on stiff substrates and the reverse combination and shows improved accuracy over previous methods.

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Corresponding author

a) Address all correspondence to this author. e-mail: vlassak@esag.harvard.edu

References

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