Hostname: page-component-8448b6f56d-dnltx Total loading time: 0 Render date: 2024-04-18T05:15:36.927Z Has data issue: false hasContentIssue false

Effect of particle size and sintering temperature on densification during coupled multifield-activated microforming

Published online by Cambridge University Press:  24 August 2012

Dong Lu
Affiliation:
School of Manufacturing Science and Engineering, Sichuan University, Chengdu, Sichuan 610065, People’s Republic of China
Yi Yang*
Affiliation:
School of Manufacturing Science and Engineering, Sichuan University, Chengdu, Sichuan 610065, People’s Republic of China
Yi Qin
Affiliation:
Department of Design, Manufacture and Engineering Management, Manufacturing Engineering Research Centre, The University of Strathclyde, Glasgow, G1 1XJ, United Kingdom
Gang Yang
Affiliation:
School of Manufacturing Science and Engineering, Sichuan University, Chengdu, Sichuan 610065, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: yangyi0822@yahoo.cn
Get access

Abstract

In this paper, a novel sintering method is introduced for the forming of microcomponents in which the loose powders were loaded directly into the die, sintered with an external electric field, a thermal field, and an external stress field (called coupled multifields activation), where the fields were generated by a Gleeble thermal simulation instrument. Two kinds of 316L stainless steel powders of different particle sizes (20 and 70 μm) with no binder were sintered with microforming using a multifield coupling method. For particle size of 20 μm, a nearly fully densified microsintered compact (relative density is 99.2%) was manufactured at a relatively low sintering temperature (900 °C) and within a relatively short sintering time (4 min). The fluctuated temperature–time curve reveals that the rapid mass transfer of liquid phase is the dominant densification mechanism in the compacts with a starting particle size of 20 μm.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Alting, L., Kimura, F., Hansen, H.N., and Bissacco, G.: Micro engineering. CIRP Ann. Manuf. Technol. 52, 635 (2003).CrossRefGoogle Scholar
Qin, Y.: Micro-Manufacturing Engineering and Technology (Elsevier Inc., Oxford, UK, 2010); p. 3.Google Scholar
Qin, Y., Brockett, A., Ma, Y., Razali, A., Zhao, J., Harrison, C., Pan, W., Dai, X., and Loziak, D.: Micro-manufacturing: Research, technology outcomes and development issues. Int. J. Adv. Manuf. Technol. 47, 821 (2010).CrossRefGoogle Scholar
Imbaby, M. and Jiang, K.: Micro fabrication of stainless steel micro components using soft moulding and aqueous slurry. Microelectron. Eng. 87, 72 (2010).CrossRefGoogle Scholar
Beeby, S., Enell, G., Kraft, M., and White, N.: MEMS Mechanical Sensors (Artech House Inc., Boston, MA, 2004); p. 2.Google Scholar
Mappes, T., Worgull, M., Heckele, M., and Mohr, J.: Submicron polymer structures with x-ray lithography and hot embossing. Microsyst. Technol. 14, 1721 (2008).CrossRefGoogle Scholar
Liu, L.H., Liu, G., Xiong, Y., Chen, J., Kang, C.L., Huang, X.L., and Tian, Y.C.: Fabrication of Fresnel zone plates with high aspect ratio by soft x-ray lithography. Microsyst. Technol. 14, 1251 (2008).CrossRefGoogle Scholar
Sheu, D-Y.: High-speed micro electrode tool fabrication by a twin-wire EDM system. J. Micromech. Microeng. 18, 105014 (2008).CrossRefGoogle Scholar
Foong, Y.M., Koh, A.T.T., Lim, S.R., Chua, D.H.C., and Ng, H.Y.. Properties of laser fabricated nanostructured Cu/diamond-like carbon composite. J. Mater. Res. 26, 2761 (2011).CrossRefGoogle Scholar
Lee, S., Chen, Y.P., and Huang, C.H.: Electroforming of metallic bipolar plates with micro-featured flow field. J. Power Sources 145, 369 (2005).CrossRefGoogle Scholar
Lee, C.H. and Jiang, K.: Fabrication of thick electroforming micro mold using a KMPR negative tone photoresist. J. Micromech. Microeng. 18, 055032 (2008).CrossRefGoogle Scholar
Gietzelt, T., Jacobi, O., Piotter, V., Ruprecht, R., and Hausselt, J.: Development of a micro annular gear pump by micro powder injection molding. J. Mater. Sci. 39, 2113 (2004).CrossRefGoogle Scholar
Loh, N.H., Tor, S.B., Tay, B.Y., Murakoshi, Y., and Maeda, R.: Fabrication of micro gear by micro powder injection molding. Microsyst. Technol. 14, 43 (2008).CrossRefGoogle Scholar
Krug, S. and Evans, J.R.G.: Packing and solidification in ceramic injection molding. J. Mater. Res. 16, 1829 (2001).CrossRefGoogle Scholar
Kim, J.S., Jiang, K., and Chang, I.: Pressure free fabrication of 3D microcomponents using Al powder. Adv. Eng. Mater. 8, 38 (2006).CrossRefGoogle Scholar
Imbaby, M., Jiang, K., and Chang, I.: Fabrication of 316-L stainless steel micro parts by soft lithography and powder metallurgy. Mater. Lett. 62, 4213 (2008).CrossRefGoogle Scholar
Butler, R., Ferrell, N., Hansford, D., and Naik, R.: Soft lithography-mediated microscale patterning of silica on diverse substrates. J. Mater. Res. 24, 1632 (2009).CrossRefGoogle Scholar
Martin, C.R. and Aksay, I.A.: Microchannel molding: A soft lithography-inspired approach to micrometer-scale patterning. J. Mater. Res. 20, 1995 (2005).CrossRefGoogle Scholar
Feng, K.Q., Hong, M., Yang, Y., and Wang, W.J.: Combustion synthesis of VC/Fe composites under the action of an electric field. Int. J. Refract. Met. Hard. Mater. 27, 852 (2009).CrossRefGoogle Scholar
Wang, S.W., Chen, L.D., and Hirai, T.: Densification of Al2O3 powder using spark plasma sintering. J. Mater. Res. 15, 982 (2000).CrossRefGoogle Scholar
Groza, J.R., Garcia, M., and Schneider, J.A.: Surface effects in field-assisted sintering. J. Mater. Res. 16, 286 (2001).CrossRefGoogle Scholar
Demuynck, M., Erauw, J-P., Van der Biest, O., Delannay, F., and Cambier, F.: Densification of alumina by SPS and HP: A comparative study. J. Eur. Ceram. Soc. 32, 1957 (2012).CrossRefGoogle Scholar
Feng, K.Q., Yang, Y., Hong, M., Wu, J.L., and Lan, S.S.: Intensified sintering of iron powders under the action of an electric field: Effect of technologic parameter on sintering densification. J. Mater. Process. Technol. 208, 264 (2008).CrossRefGoogle Scholar
Zadra, M., Casari, F., Girardini, L., and Molinari, A.: Spark plasma sintering of pure aluminium powder: Mechanical properties and fracture analysis. Powder. Metall. 50, 40 (2007).CrossRefGoogle Scholar
Jabbar, H., Couret, A., Durand, L., and Monchoux, J-P.: Identification of microstructural mechanisms during densification of a TiAl alloy by spark plasma sintering. J. Alloys Compd. 509, 9826 (2011).CrossRefGoogle Scholar
Munir, Z.A.: The effect of external electric fields on the nature and properties of materials synthesized by self-propagating combustion. Mater. Sci. Eng, A 287, 125 (2000).CrossRefGoogle Scholar
Quach, D.V., Paredes, H.A., Kim, S., Martin, M., and Munir, Z.A.: Pressure effects and grain growth kinetics in the consolidation of nanostructured fully stabilized zirconia by pulsed electric current sintering. Acta Mater. 58, 5022 (2010).CrossRefGoogle Scholar
Guan, Z.D.: Physical Properties of Inorganic Materials (Tsinghua University Press, Beijing, China, 1992); p. 25.Google Scholar
Zhu, W.T.: Physical Chemistry (Tsinghua University Press, Beijing, China, 1995); p. 128.Google Scholar
Mondal, A., Upadhyaya, A., and Agrawal, D.: Effect of heating mode and sintering temperature on the consolidation of 90W–7Ni–3Fe alloys. J. Alloys Compd. 509, 301 (2011).CrossRefGoogle Scholar
Stitzer, K.E., Smith, M.D., and Zur Loye, H.C.: Crystal growth, structure determination and magnetic properties of Ba4Ir3O10 and Ba4(Co0.4Ir0.6)Ir2O10. J. Alloys Compd. 338, 104 (2002).CrossRefGoogle Scholar