Hostname: page-component-848d4c4894-wg55d Total loading time: 0 Render date: 2024-05-15T18:37:55.502Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

Published online by Cambridge University Press:  31 January 2011

M.H. Tsai ,
Y.W. Lin ,
H.Y. Chuang  and
C.R. Kao
M.H. Tsai*
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
Y.W. Lin
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
H.Y. Chuang
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
C.R. Kao*
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
*
a) Address all correspondence to this author. e-mail: mh0617@gmail.com
b) This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/jmr_policy
Get access

Abstract

The massive spalling of Cu3Sn in the soldering reaction between high-Pb solders and Cu substrates was studied to identify the mechanism behind this rather interesting and frequently observed phenomenon. Four different alloys (99.5 Pb 0.5 Sn, 99 Pb 1S n, 97 Pb 3 Sn, and 95 Pb 5 Sn, in wt%) were soldered at 350 °C for durations ranging from 10 s to 600 min. At low Sn concentration (0.5 or 1 Sn), massive spalling occurred as early as 20 min. However, at high Sn concentration (3 or 5 Sn), massive spalling was not completed even after 600 min. To the best of our knowledge, these results are the most detailed observations ever reported on the sequence of events that occur during massive spalling. The Pb–Sn–Cu phase diagram is used to rationalize the phenomenon.

Keywords

CompoundDiffusionSoldering
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 11 , November 2009 , pp. 3407 - 3411
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Tu, K.N. and Zeng, K.: Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng., R 34, 1 (2001).CrossRefGoogle Scholar
2.Wang, K-Z. and Chen, C-M.: Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering. J. Electron. Mater. 34, 1543 (2005).CrossRefGoogle Scholar
3.Chen, S-W. and Wang, C-H.: Interfacial reactions of Sn-Cu/Ni couples at 250 C. J. Mater. Res. 21, 2270 (2006).CrossRefGoogle Scholar
4.Ho, C.E., Lin, Y.W., Yang, S.C., Kao, C.R., and Jiang, D.S.: Effectsof limited Cu supply on soldering reactions between SnAgCu and Ni. J. Electron. Mater. 35, 1017 (2006).CrossRefGoogle Scholar
5.Ho, C.E., Yang, S.C., and Kao, C.R.: Interfacial reaction issues for lead-free electronic solders. J. Mater. Sci.-Mater. Electron. 18, 155 (2007).CrossRefGoogle Scholar
6.Yang, S.C., Ho, C.E., Chang, C.W., and Kao, C.R.: Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu. J. Mater. Res. 21, 2436 (2006).CrossRefGoogle Scholar
7.Jang, J-W., Ramanathan, L.N., Lin, J-K., and Frear, D.R.: Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing. J. Appl. Phys. 95, 8286 (2004).CrossRefGoogle Scholar
8.Yang, S.C., Ho, C.E., Chang, C.W., and Kao, C.R.: Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element. J. Appl. Phys. 101, 084911 (2007).CrossRefGoogle Scholar
9.Zeng, K. and Kivilahti, J.K.: Use of multicomponent phase diagrams for predicting phase evolution in solder conductor systems. J. Electron. Mater. 30, 35 (2001).CrossRefGoogle Scholar
10.Yang, S.C., Wang, Y.W., Chang, C.C., and Kao, C.R.: Analysis and experimental verification of the volume effect in the reaction between Zn-doped solders and Cu. J. Electron.Mater. 37, 1591 (2008).CrossRefGoogle Scholar