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Effect of Solid Solution Impurities on Dislocation Nucleation During Nanoindentation

Published online by Cambridge University Press:  01 August 2005

D.F. Bahr  and
G. Vasquez
D.F. Bahr*
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
G. Vasquez
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
*
a) Address all correspondence to this author. e-mail: bahr@mail.wsu.edu
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Abstract

Dislocation nucleation in solid solutions of face-centered-cubic metallic materials was studied using nanoindentation. The effects of solute impurities in the copper–nickel system on the formation of dislocations in a previously dislocation-free region were demonstrated to be minimal. The shear stress required to nucleate dislocations in copper is approximately 1.6 GPa, while in nickel a 3.9 GPa shear stress is required. Changes in shear stress for nucleation track closely with changes in elastic modulus showing the nucleation stress is approximately 1/30 to 1/20 of the shear modulus. The expected solid-solution strengthening is identified within the same experimental method, demonstrating unambiguously the fact that solid-solution impurities in this system will impact the propagation of dislocations during plastic deformation but not alter the homogeneous nucleation of dislocations in these materials.

Keywords

DislocationsNanoindentation
Type
Rapid Communications
Information
Journal of Materials Research , Volume 20 , Issue 8 , August 2005 , pp. 1947 - 1951
Copyright
Copyright © Materials Research Society 2005

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