Hostname: page-component-848d4c4894-2pzkn Total loading time: 0 Render date: 2024-05-16T21:12:14.713Z Has data issue: false hasContentIssue false

Electron Cyclotron Resonance Plasma-assisted Reactive Pulsed Laser Deposition of Compound Films

Published online by Cambridge University Press:  31 January 2011

J. Sun
Affiliation:
State Key Laboratory for Materials Modification by Laser, Ion and Electron Beams, and Department of Optical Science and Engineering, Fudan University, Shanghai 200433, People's Republic of China
J. D. Wu*
Affiliation:
State Key Laboratory for Materials Modification by Laser, Ion and Electron Beams, and Department of Optical Science and Engineering, Fudan University, Shanghai 200433, People's Republic of China
H. Ling
Affiliation:
State Key Laboratory for Materials Modification by Laser, Ion and Electron Beams, and Department of Optical Science and Engineering, Fudan University, Shanghai 200433, People's Republic of China
W. Shi
Affiliation:
State Key Laboratory for Materials Modification by Laser, Ion and Electron Beams, and Department of Optical Science and Engineering, Fudan University, Shanghai 200433, People's Republic of China
Z. F. Ying
Affiliation:
State Key Laboratory for Materials Modification by Laser, Ion and Electron Beams, and Department of Optical Science and Engineering, Fudan University, Shanghai 200433, People's Republic of China
F. M. Li
Affiliation:
State Key Laboratory for Materials Modification by Laser, Ion and Electron Beams, and Department of Optical Science and Engineering, Fudan University, Shanghai 200433, People's Republic of China
*
a)Address all correspondence to this author. J.D. Wu, Department of Optical Science and Engineering, Fudan University, Shanghai 200433, People's Republic of China. Fax: 86-21-65641344 e-mail: jdwu@fudan.edu.cn
Get access

Abstract

A novel method was developed for low-temperature preparation of thin films. Pulsed laser ablation was combined with electron cyclotron resonance microwave discharge, constituting a novel hybrid film preparation method called electron cyclotron resonance plasma–assisted reactive pulsed laser deposition. We demonstrated the feasibility of the method by preparing compound films of silicon nitride, silicon dioxide, and aluminum nitride from elemental starting materials. The mechanisms responsible for efficient compound formation and film growth are discussed, together with characterization of the prepared films, analysis of the plasma composition, and comparison of the films prepared with and without assistance of the plasma. The unique features of the method make it suitable for one-step preparation of compound thin films at low temperatures.

Type
Articles
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Pulsed Laser Deposition of Thin Films, edited by Chrisey, D.B. and Hubler, G.K. (John Wiley & Sons, New York, 1994).Google Scholar
Gupta, A., in Pulsed Laser Deposition of Thin Films, edited by Chrisey, D.B. and Hubler, G.K. (John Wiley & Sons, New York, 1994), Chap. 10, pp. 265291.Google Scholar
Asmussen, J., J. Vac. Sci. Technol. A 7, 863 (1989).CrossRefGoogle Scholar
Matsuoka, M. and Ono, K., Appl. Phys. Lett. 50, 1864 (1987).CrossRefGoogle Scholar
Wu, J.D., Sun, J., Zhong, X.X., Zhou, Z.Y., and Li, F.M., Thin Solid Films 350, 101 (1999).CrossRefGoogle Scholar
Sun, J., Wu, J.D., Ying, Z.F., Shi, W., Zhou, Z.Y., Wang, K.L., Ding, X.M., and Li, F.M., Appl. Phys. A 73, 91 (2001).CrossRefGoogle Scholar
Schalch, D., Scharmann, A., and Wolfrat, R., Thin Solid Films 155, 301 (1987).CrossRefGoogle Scholar
Niihara, K. and Hirai, T., J. Mater. Sci. 12, 1233 (1977).CrossRefGoogle Scholar
Morishita, S., Uchida, Y., and Matsumura, M., Jpn. J. Appl. Phys. 34, 5738 (1995).CrossRefGoogle Scholar
Tsuji, M., Sakumoto, M., Itoh, N., Obase, H., and Nishimura, Y., Appl. Surf. Sci. 51, 171 (1991).CrossRefGoogle Scholar
Ashokan, R., Singh, R., Gopal, V., and Anandan, M., J. Appl. Phys. 73, 3943 (1993).CrossRefGoogle Scholar
Vispute, R.D., Narayan, J., Wu, H., and Jagannadham, K., J. Appl. Phys. 77, 4724 (1995).CrossRefGoogle Scholar
Jagannadham, K., Sharma, A.K., Wei, Q., Kalyanraman, R., and Narayan, J., J. Vac. Sci. Technol. A 16, 2804 (1998).CrossRefGoogle Scholar
Joo, H-Y., Kim, H.J., Kim, S.J., and Kim, S.Y., J. Vac. Sci. Technol. A 17, 862 (1999).CrossRefGoogle Scholar
Hasegawa, F., Takahashi, T., Kubo, K., and Nannichi, Y., Jpn. J. Appl. Phys. 26, 1555 (1987).CrossRefGoogle Scholar
Hoffman, D.M., Rangarajan, S.P., Athavale, S.D., Economou, D.J., Liu, J-R., Zheng, Z., and Chu, W-K., J. Vac. Sci. Technol. A 14, 306 (1996).CrossRefGoogle Scholar
Hubler, G.K., in Pulsed Laser Deposition of Thin Films, edited by Chrisey, D.B. and Hubler, G.I. (John Wiley & Sons, New York, 1994), Chap. 10, pp. 327355.Google Scholar
Shapoval, S.Y., Petrashov, V.T., Popov, O.A., Yoder, M.D. Jr., Maciel, P.D., and Lok, C.K.C., J. Vac. Sci. Technol. A 9, 3071 (1991).CrossRefGoogle Scholar
Zhong, X.X., Wu, J.D., Sun, J., Wu, C.Z., and Li, F.M., J. Appl. Phys. 85, 1351 (1999).CrossRefGoogle Scholar
Key, E. and Rossnagel, S.M., in Handbook of Ion Beam Processing Technology, edited by Cuomo, J.J., Rossnagel, S.M., and Kaufman, H.R. (Noyes, Park Ridge, NJ, 1989), pp. 170193.Google Scholar