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Evaluation of a silicon-containing benzocyclobutene thermoset resin as a plasma etch stop
Published online by Cambridge University Press: 31 January 2011
Abstract
An experimental silicon-containing benzocyclobutene thermosetting resin from DOW has been evaluated for use as a plasma etch stop in packaging applications. The thermal and etch properties of this particular resin (DOW UX-13005.02L) make it suitable for use as an etch stop. Further, a model for in situ laser interferometry is proposed. By applying the model to the laser interferogram, the initial etch rate and amount of material removed before etching ceases may be determined.
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