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Fabrication and structural characterization of self-supporting electrolyte membranes for a micro solid-oxide fuel cell

Published online by Cambridge University Press:  03 March 2011

Chelsey D. Baertsch ,
Klavs F. Jensen ,
Joshua L. Hertz ,
Harry L. Tuller ,
Srikar T. Vengallatore ,
S. Mark Spearing  and
Martin A. Schmidt
Chelsey D. Baertsch
Affiliation:
Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Klavs F. Jensen*
Affiliation:
Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Joshua L. Hertz
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Harry L. Tuller
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Srikar T. Vengallatore
Affiliation:
Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
S. Mark Spearing
Affiliation:
Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Martin A. Schmidt
Affiliation:
Microsystems Technology Center, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
*
b)Address all correspondence to this author. e-mail: kfjensen@mit.edu
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Abstract

Micromachined fuel cells are among a class of microscale devices being explored for portable power generation. In this paper, we report processing and geometric design criteria for the fabrication of free-standing electrolyte membranes for microscale solid-oxide fuel cells. Submicron, dense, nanocrystalline yttria-stabilized zirconia (YSZ) and gadolinium-doped ceria (GDC) films were deposited onto silicon nitride membranes using electron-beam evaporation and sputter deposition. Selective silicon nitride removal leads to free-standing, square, electrolyte membranes with side dimensions as large as 1025 μm for YSZ and 525 μm for GDC, with high processing yields for YSZ. Residual stresses are tensile (+85 to +235 MPa) and compressive (–865 to -155 MPa) in as-deposited evaporated and sputtered films, respectively. Tensile evaporated films fail via brittle fracture during annealing at temperatures below 773 K; thermal limitations are dependent on the film thickness to membrane size aspect ratio. Sputtered films with compressive residual stresses show superior mechanical and thermal stability than evaporated films. Sputtered 1025-μm membranes survive annealing at 773 K, which leads to the generation of tensile stresses and brittle fracture at elevated temperatures (923 K).

Keywords

Thin filmPhysical vapor deposition (PVD)Microelectrical mechanical (MEMS)

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Type
Articles
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Journal of Materials Research , Volume 19 , Issue 9 , September 2004 , pp. 2604 - 2615
Copyright
Copyright © Materials Research Society 2004

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