Hostname: page-component-7dd5485656-pnlb5 Total loading time: 0.001 Render date: 2025-10-31T20:55:27.115Z Has data issue: false hasContentIssue false
  • English
  • Français

Indentation plastic displacement field: Part I. The case of soft films on hard substrates

Published online by Cambridge University Press:  31 January 2011

T. Y. Tsui ,
Joost Vlassak  and
William D. Nix
T. Y. Tsui*
Affiliation:
Advanced Micro Devices, One AMD Place, Sunnyvale, California 94088
Joost Vlassak
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
William D. Nix
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
*
a)Address all correspondence to this author. e-mail: ttsui@svcam.amd.com
Get access

Abstract

The plastic deformation behavior of Knoop indentations made in a soft, porous titanium/aluminum multilayered thin film on a hard silicon substrate is studied through use of the focused-ion-beam milling and imaging technique. Pileup is observed for indentations with depths larger than 30% of the total film thickness. Analysis of the indentation cross sections shows that plastic deformation around the indentation is partly accommodated by the closing of the pores within the multilayers. This densification process reduces the amount of pileup formed below that predicted by finite element simulations. Experimental results show that the pileup is formed by an increase of the titanium layer thickness near the edges of the indentation. The thickness increase is largest near the film/substrate interface and decreases toward the surface of the multilayered film. The amount of normal compression near the center of the indenter is characterized, and it is demonstrated that the deformation becomes more nonuniform with increasing indentation depth.

Information

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 6 , June 1999 , pp. 2196 - 2203
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1.Pethica, J. B., Hutchings, R., and Oliver, W. C., Philos. Mag. A 48, 593 (1983).CrossRefGoogle Scholar
2.Doerner, M. F. and Nix, W. D., J. Mater. Res. 1, 601 (1986).CrossRefGoogle Scholar
3.Doerner, M. F., Gardner, D. S., and Nix, W. D., J. Mater. Res. 1, 845 (1986).CrossRefGoogle Scholar
4.Oliver, W.C. and Pharr, G. M., J. Mater. Res. 7, 1564 (1992).CrossRefGoogle Scholar
5.ASTM, Standard Test Method for Vickers Hardness of Metallic Materials (1987).Google Scholar
6.Lebouvier, D., Gilormini, P., and Felder, E., J. Phys. D: Appl. Phys. 18, 199 (1985).CrossRefGoogle Scholar
7.Tsui, T.Y., Oliver, W. C., and Pharr, G.M., in Thin Films: Stresses and Mechanical Properties VI, edited by Gerberich, W.W., Gao, H., Sundgren, J-E., and Baker, S. P. (Mater. Res. Soc. Symp. Proc. 436, Pittsburgh, PA, 1997), pp. 147–152.Google Scholar
8.Bhattacharya, A. K. and Nix, W.D., Int. J. Solid Struct. 24 (12), 1287 (1988).CrossRefGoogle Scholar
9.Hill, R., Philos. Mag. 41 (319), 745 (1950).CrossRefGoogle Scholar
10.King, R. B., Int. J. Solids Struct. 23 (12), 1657 (1987).CrossRefGoogle Scholar
11.Stone, D. S., J. Electron. Pack. 112, 41 (1990).CrossRefGoogle Scholar
12.Tsui, T.Y., Ross, C. A., and Pharr, G. M., in Materials Reliability in Microelectronics VII, edited by Clement, J.J., Keller, R. R., Krisch, K. S., Sanchez, J. E. Jr, and Suo, Z. (Mater. Res. Soc. Symp. Proc. 473, Pittsburgh, PA, 1997), pp. 57–62.Google Scholar
13.Tsui, T.Y., Ross, C. A., and Pharr, G. M., in Materials Reliability in Microelectronics VII, edited by Clement, J.J., Keller, R. R., Krisch, K. S., Sanchez, J. E. Jr, and Suo, Z. (Mater. Res. Soc. Symp. Proc. 473, Pittsburgh, PA, 1997), pp. 51–56.Google Scholar
14.Tsui, T.Y., Bolshakov, A., and Pharr, G. M., unpublished.Google Scholar
15.Tsui, T.Y. and Pharr, G. M., J. Mater. Res. 14, 292 (1999).CrossRefGoogle Scholar
16.Hill, R., The Mathematical Theory of Plasticity (Clarendon Press, Oxford, 1950).Google Scholar
17.Tabor, D., Indentation Hardness and Its Measurement: Some Cautionary Comments, in Microindentation Techniques in Materials Science and Engineering, edited by Blau, P. J. and Lawn, B. R. (American Society for Testing and Materials, Philadelphia, PA, 1986).Google Scholar
18.Bolshakov, A., Oliver, W.C., and Pharr, G. M., J. Mater. Res. 11, 760 (1996).CrossRefGoogle Scholar
19.Bolshakov, A., Ph.D. Thesis, Rice University (1996).Google Scholar
20.Giannakopoulos, A.E., Larsson, P. L., and Vestergaard, R., Int. J. Solids Struct. 31 (19), 2679 (1994).CrossRefGoogle Scholar
21.Laursen, L.A. and Simo, J. C., J. Mater. Res. 7, 618 (1992).CrossRefGoogle Scholar
22.Vlassak, J. J., Tsui, T. Y., and Nix, W.D., in Thin Films—Stresses and Mechanical Properties VII, edited by Cammarata, R. C., Busso, E. P., Nastasi, M., and Oliver, W.C. (Mater. Res. Soc. Symp. Proc. 505, Pittsburgh, PA, 1998).Google Scholar
23.Pharr, G.M., Oliver, W.C., and Clarke, D. R., Scripta Metall. 23, 1949 (1989).CrossRefGoogle Scholar
24.Courtney, T.H., Mechanical Behavior of Materials, 1st ed., Materials Science and Engineering (McGraw-Hill Publishing Company, New York, 1990).Google Scholar
25.Brookes, C.A., Properties of Diamond, edited by Field, J. E. (Academic Press, New York, 1979).Google Scholar
26.Simmons, G. and Wong, H., Single Crystal Elastic Constants and Calculated Aggregate Properties: A Handbook (M.I.T Press, Cambridge, MA, 1971).Google Scholar
27.Vlassak, J. J. and Nix, W. D., J. Mech. Phys. Solids 42, 1223 (1994).CrossRefGoogle Scholar
28.Vlassak, J. J. and Nix, W. D., Philos. Mag. A67, 1045 (1993).CrossRefGoogle Scholar
29.Tsui, T.Y., Ph.D. Thesis, Rice University (1996).Google Scholar