Hostname: page-component-76fb5796d-9pm4c Total loading time: 0 Render date: 2024-04-26T13:50:45.825Z Has data issue: false hasContentIssue false
  • English
  • Français

Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C

Published online by Cambridge University Press:  31 January 2011

Chih-Chi Chen ,
Ya-Ting Chan  and
Yue-Ting Chen
Yue-Ting Chen
Affiliation:
R&D Center for Membrane Technology and Department of Chemical Engineering, Chung Yuan Christian University, Chung Li, Taiwan 32023
Get access

Abstract

Sn-xCu/Ni-yCo (x = 0.2–1.0 wt%, y = 10, 20, 40 at.%) interfacial reactions at 250 °C are examined in this study. Sn-Cu alloys are promising lead free solders, and Ni-Co alloys are the potential diffusion barrier layer materials in flip chip packaging. The Co and Cu effects on the Sn-Cu/Ni-Co interfacial reactions are examined. When the Co addition is 10 at.%, the reaction phases are the Ni3Sn4 and Cu6Sn5 phase, and Sn-Cu/Ni-10at.%Co interfacial reactions are similar to those of Sn-Cu/Ni. When the Co addition is 20 at.%, the CoSn2 phase is formed, and the reaction path is Sn-Cu/Ni3Sn4/CoSn2/Ni-20at.%Co. When the Co addition is 40 at.%, only Sn-Co binary phases are formed (CoSn2 and CoSn3), and Sn-Ni binary phases are not formed. The Cu6Sn5 phase is not formed until the Cu content is higher than 0.7 wt%. The Cu concentration effect is the main drawback of using Ni as the diffusion barrier layer material and the Sn-Cu solders. The Cu concentration effect of the Sn-Cu/Ni-Co interfacial reactions is not as pronounced as that of Sn-Cu/Ni.

Keywords

SolderingPackagingDiffusion
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 7 , July 2010 , pp. 1321 - 1328
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Chou, C-Y., Chen, S-W., Chang, Y-S.Interfacial reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni couples. J. Mater. Res. 21, 1849 (2006)CrossRefGoogle Scholar
2.Yoon, J-W., Lim, J.H., Lee, H-J., Joo, J., Jung, S-B., Moon, W-C.Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C. J. Mater. Res. 21, 2897 (2006)CrossRefGoogle Scholar
3.Islam, M.N., Chan, Y.C., Sharif, A.Interfacial reactions of Sn-Cu and Sn-Pb-Ag solder with Au/Ni during extended time reflow in ball grid array packages. J. Mater. Res. 19, 2897 (2004)CrossRefGoogle Scholar
4.Han, H., Sohn, Y.C., Yu, J.Interfacial reactions between CuxNiy alloy underbump metallurgy and Sn-Ag-zCu solders. J. Electron. Mater. 36, 578 (2007)CrossRefGoogle Scholar
5.International Technology Roadmap for Semiconductors (ITRS) Assembly and Packaging 6570 (2007) Available at http://www.itrs.net/Links/2007ITRS/2007_Chapters/2007_Assembly.pdfGoogle Scholar
6.Chen, C-C., Chen, S-W., Chang, C-H.Characterization of the ternary phase at the Sn/Ni-V joint. J. Mater. Res. 23, 2743 (2008)CrossRefGoogle Scholar
7.Laurila, T., Vuorinen, V., Kivilahti, J.K.Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng., R 49, 1 (2005)CrossRefGoogle Scholar
8.Zeng, K., Tu, K.N.Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 55 (2002)CrossRefGoogle Scholar
9.Chen, S-W., Chen, C-C., Chang, C-H.Interfacial reactions in Sn/Ni-7wt%V couple. Scr. Metall. 56, 453 (2007)CrossRefGoogle Scholar
10.Labie, R., Beyne, E., Mertens, R., Ratchev, P., Humbeeck, J.V.Investigation of the reliability of Cu and Co UBM layers in thermal-cycling testsProceedings of the 5th Electronics Packaging Technology Conference (IEEE, Los Alamitos, CA 2003)584Google Scholar
11.Labie, R., Beyne, E., Ratchev, P.Investigation of Co UBM for direct bumping on Cu/low k diesProceedings of the 53th Electronic Components & Technology Conference (IEEE, Los Alamitos, CA 2003)12301234Google Scholar
12.Ratchev, P., Labie, R., Beyne, E.Nanohardness study of CoSn2 intermetallic layers formed between Co UBM and Sn flip-chip solder jointsProceedings of the 6th Electronics Packaging Technology Conference (IEEE, Los Alamitos, CA 2004)339342Google Scholar
13.Labie, R., Ratchev, P., Beyne, E.Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumpsProceedings of the 55th Electronic Components & Technology Conference Vol. 1 (IEEE, Los Alamitos, CA 2005)449451Google Scholar
14.Liang, M-W., Yen, H-T., Hsieh, T-E.Investigation of electroless cobalt-phosphorous layer and its diffusion barrier properties of Pb-Sn solder. J. Electron. Mater. 35, 1593 (2006)CrossRefGoogle Scholar
15.Zhu, W.J., Wang, J., Liu, H.S., Jin, Z.P., Gong, W.P.The interfacial reaction between Sn-Ag alloys and Co substrate. Mater. Sci. Eng., A 456, 109 (2007)CrossRefGoogle Scholar
16.Wu, W-C., Hsieh, T-E., Pan, H-C.Investigation of electroless Co(W,P) thin film as the diffusion barrier of underbump metallurgy. J. Electrochem. Soc. 155, D369 (2008)CrossRefGoogle Scholar
17.Luo, W.C., Ho, C.E., Tsai, J.Y., Lin, Y.L., Kao, C.R.Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations. Mater. Sci. Eng., A 396, 385 (2005)CrossRefGoogle Scholar
18.Chen, W.T., Ho, C.E., Kao, C.R.Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders. J. Mater. Res. 17, 263 (2002)CrossRefGoogle Scholar
19.Chen, S-W., Wang, C-H.Interfacial reactions of Sn-Cu/Ni couples at 250 °C. J. Mater. Res. 21, 2270 (2006)CrossRefGoogle Scholar
20.Wang, C-H., Chen, S-W.Sn-0.7wt%Cu/Ni interfacial reactions at 250 °C. Acta Mater. 54, 247 (2006)CrossRefGoogle Scholar
21.Chen, S-W., Wu, S-H., Lee, S-W.Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems. J. Electron. Mater. 32, 1188 (2003)CrossRefGoogle Scholar
22.Chen, C-M., Chen, S-W.Electromigration effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt% Ag/Ni interfacial reactions. J. Appl. Phys. 90, 1208 (2001)CrossRefGoogle Scholar
23.Kao, S-T., Duh, J-G.Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization. J. Electron. Mater. 34, 1129 (2005)CrossRefGoogle Scholar
24.Hsu, S.C., Wang, S.J., Liu, C.Y.Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization. J. Electron. Mater. 32, 1214 (2003)CrossRefGoogle Scholar
25.Wang, S.J., Kao, H.J., Liu, C.Y.Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps. J. Electron. Mater. 33, 1130 (2004)CrossRefGoogle Scholar
26.Chiu, T-C., Lin, K-L.The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing. Intermetallics 17, 1105 (2009)CrossRefGoogle Scholar
27.Kim, K.S., Huh, S.H., Suganuma, K.Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints. J. Alloys Compd. 352, 226 (2003)CrossRefGoogle Scholar
28.Cheng, M.D., Yen, S.F., Chuang, T.H.Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages. J. Electron. Mater. 33, 171 (2004)CrossRefGoogle Scholar
29.Wang, C-H., Chen, S-W.Cruciform pattern formation in Sn/Co couples. J. Mater. Res. 22, 3404 (2007)CrossRefGoogle Scholar
30.Wang, C-H., Chen, S-W.Sn/Co solid/solid interfacial reactions. Intermetallics 16, 524 (2008)CrossRefGoogle Scholar
31.Zhu, W.J., Liu, H.S., Wang, J., Jin, Z.P.Formation of intermetallic compound (IMC) between Sn and Co substrate. J. Alloys Compd. 456, 113 (2008)CrossRefGoogle Scholar
32.Franchuk, V.I., Larikov, L.N., Maksimenko, E.A., Mudruk, P.V.Investigation of the early stages of reactive interdiffusion kinetics in Co-Ga and Co-Sn systems. Met. Phys. Adv. Tech. 16, 145 (1996)Google Scholar
33.Takashi, Y., Shigeaki, S., Shinji, K., Keisuke, U., Kojiro, K., Masaaki, I., Kazuhiro, S., Akio, H., Masaharu, Y.Reactivity between Sn-Ag solder and Au/Ni-Co plating to form intermetallic phases. Mater. Trans. 46, 2406 (2005)Google Scholar
34.Chao, Y-H., Chen, S-W., Chang, C-H., Chen, C-C.Phase equilibria of Sn-Co-Ni system and interfacial reactions in Sn/(Co,Ni) couples. Metall. Mater. Trans. A 39, 477 (2008)CrossRefGoogle Scholar
35.Chen, C-C., Chan, Y-T.Sn/Ni–Co solid/solid interfacial reactions. Intermetallics 18, 649 (2010)CrossRefGoogle Scholar
36.Chen, C-W.Interfacial reaction between Sn(Cu) solder and NiCo alloy UBM. Masters Thesis National Center University, Taiwan 2009Google Scholar
37.Nash, P., Nash, A.The Ni-Sn (nickel-tin) system. Bull. Alloy Phase Diagrams 6, 350 (1985)CrossRefGoogle Scholar
38.Schmetterer, C., Flandorfer, H., Richter, K.W., Saeed, U., Kauffman, M., Roussel, P., Ipser, H.A new investigation of the system Ni-Sn. Intermetallics 15, 869 (2007)CrossRefGoogle Scholar
39.Lang, A., Jeitschko, W.Two new phases in the system cobalt-tin: The crystal structures of α-CoSn3 and β-CoSn3. Z. Metallkd. 87, 759 (1996)Google Scholar
40.Saunders, N., Miodownik, A.P.The Cu-Sn (copper-tin) system. Bull. Alloy Phase Diagrams 11, 278 (1990)CrossRefGoogle Scholar
41.Chen, C-C., Gierlotka, W., Chen, S-W.Phase equilibria of the Sn-V System and interfacial reactions in Sn/V couples. J. Electron. Mater. 37, 1727 (2008)CrossRefGoogle Scholar
42.van Loo, F.J.J., Rieck, G.D.Diffusion in the titanium-aluminum system. I. Interdiffusion between solid aluminum and titanium or titanium-aluminum alloys. Acta Metall. 21, 61 (1973)CrossRefGoogle Scholar
43.Lin, C-H., Chen, S-W., Wang, C-H.Phase equilibria and solidification properties of Sn-Cu-Ni alloys. J. Electron. Mater. 31, 907 (2002)CrossRefGoogle Scholar
44.Clark, J.B.Conventions for plotting the diffusion paths in multiphase ternary diffusion couples on the isothermal section of a ternary phase diagram. Trans. Metall. Soc. AIME 227, 1251 (1963)Google Scholar
45.Chen, Y-K.Sn-Co-Cu-Ni phase equilibria and Sn-Co-(Cu)/Ni interfacial reactions. Masters Thesis National Tsing Hua University, Taiwan 2009Google Scholar
46.Sun, P., Andersson, C., Wei, X., Cheng, Z., Shangguan, D., Liu, J.Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering. Mater. Sci. Eng., B 135, 134 (2006)CrossRefGoogle Scholar
47.Nishikawa, H., Komatsu, A., Takemoto, T.Interfacial reaction between Sn-Ag-Co solder and metals. Mater. Trans. 46, (11)2394 (2005)CrossRefGoogle Scholar
48.Chen, S-W., Chen, Y-K., Wu, H-J., Huang, Y-C., Chen, C-M.Private communication. National Tsing Hua University, Taiwan (2010)Google Scholar
49.Liou, W.K., Yen, Y.W.Interfacial reactions between Cu addition on Sn-9Zn lead-free solder and Ni substrate. J. Electron. Mater. 38, 2222 (2009)CrossRefGoogle Scholar