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Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints

Published online by Cambridge University Press:  31 January 2011

Kyoo-Sik Bae  and
Si-Jung Kim
Kyoo-Sik Bae
Affiliation:
Department of Electronic Materials Engineering, The University of Suwon, Suwon, Kyunggi-do, 445–743, Korea
Si-Jung Kim
Affiliation:
Department of Electronic Materials Engineering, The University of Suwon, Suwon, Kyunggi-do, 445–743, Korea
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Abstract

The microstructure and adhesion strength of the Sn–0.7Cu/Cu solder joints were examined. The acicular η(Cu6Sn5)-phase was formed inside the solder and at the solder/Cu interface, mostly in the direction normal to the interface. Compared to the Sn–3.5Ag alloy, the Sn–0.7Cu solder showed comparable wettability, but lower microhardness and joint strength. After aging, the acicular η-phase grew into a round and scallop-shaped morphology, thin є(Cu3Sn)-phase evolved just above the Cu substrate, and the joint strength decreased linearly with aging time.

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Type
Articles
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Journal of Materials Research , Volume 17 , Issue 4 , April 2002 , pp. 743 - 746
Copyright
Copyright © Materials Research Society 2002

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