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Monotonic and cyclic mechanical reliability of metallization lines on polymer substrates

  • Oleksandr Glushko (a1), Andreas Klug (a2), Emil J.W. List-Kratochvil (a3) and Megan J. Cordill (a1)


Mechanical stability of Ag and Cu printed and evaporated metallization lines on polymer substrates is investigated by means of monotonic tensile and cyclic bending tests. It is shown that lines which demonstrate good performance during monotonic tests fail at lower strains during a cyclic bending tests. Evaporated lines with the grain size of several hundreds of nanometers have good ductility and consequently good stability during monotonic loading but at the same time they fail at low strains during cyclic bending. Printed lines with nanocrystalline microstructure, in contrast, demonstrate more intensive cracking during monotonic loading but higher failure strains during cyclic bending. Apart from the grain size effect, the effect of film thickness on the saturation crack density after cyclic bending is also demonstrated. Thinner films have higher crack density in accordance with the shear lag model.


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Present Address: AVL List GmbH, Hans-List-Platz 1, A-8020 Graz, Austria,

Contributing Editor: Erik G. Herbert



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1. Nau, S., Wolf, C., Sax, S., and List-Kratochvil, E.J.W.: Organic non-volatile resistive photo-switches for flexible image detector arrays. Adv. Mater. 27, 1048 (2015).
2. Nau, S., Wolf, C., Popovic, K., Blümel, A., Santoni, F., Gagliardi, A., di Carlo, A., Sax, S., and List-Kratochvil, E.J.W.: Inkjet-printed resistive switching memory based on organic dielectric materials: From single elements to array technology. Adv. Electron. Mater. 1, 140003-1 (2015).
3. Graz, I., Kaltenbrunner, M., Keplinger, C., Schwödiauer, R., Bauer, S., Lacour, S.P., and Wagner, S.: Flexible ferroelectret field-effect transistor for large-area sensor skins and microphones. Appl. Phys. Lett. 89, 073501-1 (2006).
4. Koo, M., Il Park, K., Lee, S.H., Suh, M., Jeon, D.Y., Choi, J.W., Kang, K., and Lee, K.J.: Bendable inorganic thin-film battery for fully flexible electronic systems. Nano Lett. 12, 4810 (2012).
5. Klug, A., Patter, P., Popovic, K., Blümel, A., Sax, S., Lenz, M., Glushko, O., Cordill, M.J., and List-Kratochvil, E.J.W.: Recent progress in printed 2/3D electronic devices. In. Proc. Spie 9569, List Kratochvil, E.J.W., ed. (SPIE, San Diego, 2015); p. 95690N.
6. Woo, N.C., Cherenack, K., Tröster, G., and Spolenak, R.: Designing micro-patterned Ti films that survive up to 10% applied tensile strain. Appl. Phys. A 100, 281 (2010).
7. Lu, N., Wang, X., Suo, Z., and Vlassak, J.J.: Metal films on polymer substrates stretched beyond 50%. Appl. Phys. Lett. 91, 221909-1 (2007).
8. Marx, V.M., Toth, F., Wiesinger, A., Berger, J., Kirchlechner, C., Cordill, M.J., Fischer, F.D., Rammerstorfer, F.G., and Dehm, G.: The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model. Acta Mater. 89, 278 (2015).
9. Olliges, S., Gruber, P.A., Auzelyte, V., Ekinci, Y., Solak, H.H., and Spolenak, R.: Tensile strength of gold nanointerconnects without the influence of strain gradients. Acta Mater. 55, 5201 (2007).
10. Frank, S., Handge, U.A., Olliges, S., and Spolenak, R.: The relationship between thin film fragmentation and buckle formation: Synchrotron-based in situ studies and two-dimensional stress analysis. Acta Mater. 57, 1442 (2009).
11. Gruber, P.A., Arzt, E., and Spolenak, R.: Brittle-to-ductile transition in ultrathin Ta/Cu film systems. J. Mater. Res. 24, 1906 (2009).
12. Cordill, M.J., Fischer, F.D., Rammerstorfer, F.G., and Dehm, G.: Adhesion energies of Cr thin films on polyimide determined from buckling: Experiment and model. Acta Mater. 58, 5520 (2010).
13. Erdem Alaca, B., Saif, M.T.A., and Sehitoglu, H.: On the interface debond at the edge of a thin film on a thick substrate. Acta Mater. 50, 1197 (2002).
14. Andersons, J., Tarasovs, S., and Leterrier, Y.: Evaluation of thin film adhesion to a compliant substrate by the analysis of progressive buckling in the fragmentation test. Thin Solid Films 517, 2007 (2009).
15. Glushko, O. and Cordill, M.J.: Electrical resistance of metal films on polymer substrates. Exp. Tech. 40, 303 (2016).
16. Glushko, O., Marx, V.M., Kirchlechner, C., Zizak, I., and Cordill, M.J.: Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain. Thin Solid Films 552, 141 (2014).
17. Wyss, A., Schamel, M., Sologubenko, A.S., Denk, R., Hohage, M., Zeppenfeld, P., and Spolenak, R.: Reflectance anisotropy spectroscopy as a tool for mechanical characterization of metallic thin films. J. Phys. D: Appl. Phys. 48, 415303-1 (2015).
18. Sim, G.D., Hwangbo, Y., Kim, H.H., Lee, S.B., and Vlassak, J.J.: Fatigue of polymer-supported Ag thin films. Scr. Mater. 66, 915 (2012).
19. Lambricht, N., Pardoen, T., and Yunus, S.: Giant stretchability of thin gold films on rough elastomeric substrates. Acta Mater. 61, 540 (2013).
20. Putz, B., Schoeppner, R.L., Glushko, O., Bahr, D.F., and Cordill, M.J.: Improved electro-mechanical performance of gold films on polyimide without adhesion layers. Scr. Mater. 102, 23 (2015).
21. Choa, S-H., Cho, C-K., Hwang, W-J., Tae Eun, K., and Kim, H-K.: Mechanical integrity of flexible InZnO/Ag/InZnO multilayer electrodes grown by continuous roll-to-roll sputtering. Sol. Energy Mater. Sol. Cells 95, 3442 (2011).
22. Glushko, O., Cordill, M.J., Klug, A., and List-Kratochvil, E.J.W.: The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates. Microelectron. Reliab. 56, 109 (2016).
23. Guan, Q., Laven, J., Bouten, P.C.P., and de With, G.: Mechanical failure of brittle thin films on polymers during bending by two-point rotation. Thin Solid Films 611, 107 (2016).
24. Vellinga, W.P., De Hosson, J.T.M., and Bouten, P.C.P.: Direct measurement of intrinsic critical strain and internal strain in barrier films. J. Appl. Phys. 110, 044907-1 (2011).
25. Kim, B.J., Shin, H.A.S., Lee, J.H., Yan, T.Y., Haas, T., Gruber, P., Chou, I.S., Kraft, O., and Joo, Y.C.: Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates. J. Mater. Res. 29, 2827 (2014).
26. Kim, B-J., Haas, T., Friederich, A., Lee, J-H., Nam, D-H., Binder, J.R., Bauer, W., Choi, I-S., Joo, Y-C., Gruber, P.A., and Kraft, O.: Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices. Nanotechnology 25, 125706-1 (2014).
27. Sim, G-D., Lee, Y-S., Lee, S-B., and Vlassak, J.J.: Effects of stretching and cycling on the fatigue behavior of polymer-supported Ag thin films. Mater. Sci. Eng., A 575, 86 (2013).
28. Schwaiger, R. and Kraft, O.: Size effects in the fatigue behavior of thin Ag films. Acta Mater. 51, 195 (2003).
29. Kraft, O., Wellner, P., Hommel, M., Schwaiger, R., and Arzt, E.: Fatigue behavior of polycrystalline thin copper films. Zeitschrift Fuer Met. Res. Adv. Tech. 93, 392 (2002).
30. Zhang, G.P., Volkert, C.A., Schwaiger, R., Arzt, E., and Kraft, O.: Damage behavior of 200-nm thin copper films under cyclic loading. J. Mater. Res. 20, 201 (2005).
31. Wang, D., Gruber, P.A., Volkert, C.A., and Kraft, O.: Influences of Ta passivation layers on the fatigue behavior of thin Cu films. Mater. Sci. Eng., A 610, 33 (2014).
32. Gruber, P.A., Böhm, J., Onuseit, F., Wanner, A., Spolenak, R., and Arzt, E.: Size effects on yield strength and strain hardening for ultra-thin Cu films with and without passivation: A study by synchrotron and bulge test techniques. Acta Mater. 56, 2318 (2008).
33. Cordill, M.J. and Taylor, A.A.: Thickness effect on the fracture and delamination of titanium films. Thin Solid Films 589, 209 (2015).
34. Kim, S., Won, S., Sim, G-D., Park, I., and Lee, S-B.: Tensile characteristics of metal nanoparticle films on flexible polymer substrates for printed electronics applications. Nanotechnology 24, 085701-1 (2013).
35. Greer, J.R. and Street, R.A.: Thermal cure effects on electrical performance of nanoparticle silver inks. Acta Mater. 55, 6345 (2007).
36. Gamerith, S., Klug, A., Scheiber, H., Scherf, U., Moderegger, E., and List, E.J.W.: Direct ink-jet printing of Ag-Cu nanoparticle and Ag-precursor based electrodes for OFET applications. Adv. Funct. Mater. 17, 3111 (2007).
37. Lu, N., Suo, Z., and Vlassak, J.J.: The effect of film thickness on the failure strain of polymer-supported metal films. Acta Mater. 58, 1679 (2010).
38. Pande, C.S. and Cooper, K.P.: Nanomechanics of Hall–Petch relationship in nanocrystalline materials. Prog. Mater. Sci. 54, 689 (2009).
39. Glushko, O., Klug, A., List-Kratochvil, E.J.W., and Cordill, M.J.: Relationship between mechanical damage and electrical degradation in polymer-supported metal films subjected to cyclic loading. Mater. Sci. Eng., A 662, 157 (2016).
40. Agrawal, D.C. and Raj, R.: Measurement of the ultimate shear strength of a metal–ceramic interface. Acta Metall. 37, 1265 (1989).
41. Hsueh, C.H. and Yanaka, M.: Multiple film cracking in film/substrate systems with residual stresses and unidirectional loading. J. Mater. Sci. 38, 1809 (2003).
42. Yanaka, M., Tsukahara, Y., Nasako, N., and Takeda, N.: Cracking phenomena of brittle films in nanostructure composites analysed by a modified shear lag model with residual strain. J. Mater. Sci. 33, 2111 (1998).
43. Ahmed, F., Bayerlein, K., Rosiwal, S.M., Göken, M., and Durst, K.: Stress evolution and cracking of crystalline diamond thin films on ductile titanium substrate: Analysis by micro-Raman spectroscopy and analytical modelling. Acta Mater. 59, 5422 (2011).


Monotonic and cyclic mechanical reliability of metallization lines on polymer substrates

  • Oleksandr Glushko (a1), Andreas Klug (a2), Emil J.W. List-Kratochvil (a3) and Megan J. Cordill (a1)


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