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A new surface-alloying technique for pure copper

Published online by Cambridge University Press:  31 January 2011

M-X. Zhang ,
K. Reilly  and
P. M. Kelly
M-X. Zhang
Affiliation:
Department of Mining, Minerals and Materials Engineering, University of Queensland, St. Lucia, Brisbane, QLD 4072, Australia
K. Reilly
Affiliation:
Department of Mining, Minerals and Materials Engineering, University of Queensland, St. Lucia, Brisbane, QLD 4072, Australia
P. M. Kelly
Affiliation:
Department of Mining, Minerals and Materials Engineering, University of Queensland, St. Lucia, Brisbane, QLD 4072, Australia
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Abstract

A totally new technique of surface modification—thermal surface-alloying treatment for pure copper—was developed. A 0.2–1.8 mm copper alloy layer, which has a hardness 4 to 5 times higher than the pure copper substrate, was formed after the treatment. The significance of this technique is that the surface of pure copper can be efficiently hardened without significant reduction of the overall thermal and electrical conductivity. Variations of composition and microstructure in the alloy layer were studied after pure copper was surface alloy treated with aluminum.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 8 , August 1999 , pp. 3271 - 3274
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1.Budinski, K.G., Surface Engineering for Wear Resistance, (Prentice Hall, Inc., Englewood Cliffs, NJ, 1988), p. 161.Google Scholar
2.Dubrujeaud, B., Fontes, A., Forget, P., and Papahpilippou, C., Surf. Eng. (UK), 13, 461 (1997).CrossRefGoogle Scholar
3.Tsunekawa, Y., Materia Japan, 34, 730 (1995).CrossRefGoogle Scholar
4.Hirose, A. and Kobayashi, K.F., Mater. Sci. Eng. A, A174, 199 (1994).CrossRefGoogle Scholar
5.Kamalu, J.N. and McDarmaid, D.S., Diffusion Bonding 2, (Elsevier Science Publishers Ltd., New York, 1991), p. 119.Google Scholar
6.Zemker, R., Mater. Sci. Forum 102–104, 459 (1992).CrossRefGoogle Scholar
7.McCafferty, E., Natishan, P.M., and Hubler, G.K., Interface 2(3), 45 (1993).Google Scholar
8.Manna, I. and Majumdar, J.D., J. Mater. Sci. Lett. 20, 920 (1993).Google Scholar
9.Timsit, R.S. and Lauzon, D.C., J. Mater. Res. 9, 531 (1994).Google Scholar
10.Bailey, A.R., A Text-Book of Metallurgy (Macmillan and Co. Ltd., London, 1954), p. 503.Google Scholar