Hostname: page-component-76fb5796d-2lccl Total loading time: 0 Render date: 2024-04-28T15:12:20.792Z Has data issue: false hasContentIssue false

Properties of YBa2Cu3O7−δ multilayer films from the fluoride-based sol-gel process

Published online by Cambridge University Press:  31 January 2011

M. P. Siegal
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185–1421
J. T. Dawley
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185–1421
D. L. Overmyer
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185–1421
Get access

Abstract

The inability to rapidly grow thick or multilayer epitaxial films for either electronic or electrical power applications limits the utility of fluoride-based processes for YBa2Cu3O7−δ (YBCO). This problem is due to the use of water vapor in the growth process, necessary for the dissociation of metallofluorides. Flowing wet gas at low temperatures is corrosive to cuprates and responsible for destroying underlying YBCO layers in attempts to grow secondary layers. This is avoided simply by increasing the temperature where vapor is introduced into the growth ambient. Resulting two-layer films of YBCO have properties similar to those of high critical current density single-layer films.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Siegal, M.P., Phillips., J.M., Hsieh, Y-F., and Marshall., J.H., Physica C 172, 282 (1990).CrossRefGoogle Scholar
2.Hsieh, Y-F., Siegal., M.P., Hull, R., and Phillips., J.M., Appl. Phys. Lett. 57, 2268 (1990).CrossRefGoogle Scholar
3.Solovyov., V.F., Wiesmann., J.J., Wu, L-J., Zhu, Y., and Suenaga, M., Appl. Phys. Lett. 76, 1911 (2000).CrossRefGoogle Scholar
4.Mankiewich., P.M., Scofield., J.H., Skocpol., W.J., Howard., R.E., Dayem., A.H., and Good, E., Appl. Phys. Lett. 51, 1753 (1987).CrossRefGoogle Scholar
5.Siegal., M.P., Phillips., J.M., van. Dover, R.B., Tiefel., T.H., and Marshall., J.H., J. Appl. Phys. 68, 6353 (1990).CrossRefGoogle Scholar
6.Mogro-Campero, A. and Turner., L.G., Appl. Phys. Lett. 58, 417 (1991).CrossRefGoogle Scholar
7.Feenstra, R., Lindemer., T.B., Budai., J.D., and Galloway., M.D., J. Appl. Phys. 69, 6569 (1991).CrossRefGoogle Scholar
8.Siegal., M.P., Hou., S.Y., Phillips., J.M., Tiefel., T.H., and Marshall., J.H., J. Mater. Res. 7, 2658 (1992).CrossRefGoogle Scholar
9.McIntyre., P.C., Cima., M.J., Smith., J.A. Jr, Hallock., R.B., Siegal., M.P., and Phillips., J.M., J. Appl. Phys. 71, 1868 (1992).CrossRefGoogle Scholar
10.Chan, S-W., Bagley., B.G., Greene., L.H., Giroud, M., Feldmann., W.L., Jenkin., K.R. II, and Wilkins., B.J., Appl. Phys. Lett. 53, 1443 (1988).CrossRefGoogle Scholar
11.Garzon., F.H., Beery., J.G., Brown., D.R., Sherman., R.J., and Raistrick., I.D., Appl. Phys. Lett. 54, 1365 (1989).CrossRefGoogle Scholar
12.Ijima, Y., Tanabe, N., Kohno, O., and Ikeno, Y., Appl. Phys. Lett. 60, 769 (1992).CrossRefGoogle Scholar
13.Goyal, A., Norton., D.P., Budai., J.D., Paranthaman, M., Specht., E.D., Kroeger., D.M., Christen., D.K., He, Q., Saffian, B., List., F.A., Lee., D.F., Martin., P.M., Klabunde., C.E., Hartfield, E., and Sikka., V.K., Appl. Phys. Lett. 69, 1795 (1996).CrossRefGoogle Scholar
14.Dawley., J.T., Clem., P.G., Siegal., M.P., and Overmyer., D.L., J. Mater. Res. 16, 13 (2001).CrossRefGoogle Scholar
15.Dawley., J.T., Clem., P.J., Siegal., M.P., Overmyer., D.L., and Rodriguez., M.A., IEEE Trans. Appl. Supercond. 16, 2873 (2001).CrossRefGoogle Scholar
16.Smith., J.A., Cima., A.J., and Sonnenberg, N., IEEE Trans. Appl. Supercond. 9, 1531 (1999).CrossRefGoogle Scholar
17.Siegal., M.P., Overmyer., D.L., Venturini., E.L., Padilla., R.R., and Provencio., P.N., J. Mater. Res. 14, 4482 (1999).CrossRefGoogle Scholar
18.Gyorgy., E.M., van. Dover, R.B., Jackson., K.A., Schneemeyer., L.F., and Waszczak., J.V., Appl. Phys. Lett. 55, 283 (1989).CrossRefGoogle Scholar