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Rapid consolidation processing of silicon nitride powders

Published online by Cambridge University Press:  31 January 2011

J. A. Schneider ,
S. H. Risbud  and
A. K. Mukherjee
J. A. Schneider
Affiliation:
Division of Materials Science and Engineering, Department of Chemical Engineering and Materials Science, University of California at Davis, Davis, California 95616–5294
S. H. Risbud
Affiliation:
Division of Materials Science and Engineering, Department of Chemical Engineering and Materials Science, University of California at Davis, Davis, California 95616–5294
A. K. Mukherjee
Affiliation:
Division of Materials Science and Engineering, Department of Chemical Engineering and Materials Science, University of California at Davis, Davis, California 95616–5294
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Abstract

Using a Plasma Assisted Sintering (PAS) process, submicron size, silicon nitride powders were consolidated to >99% of the theoretical density (TD) at 1750 °C in less than 5 min with retention of the a phase and the submicron grain size. The silicon nitride powders were sintered with 5 wt.% Y2O3 and 5 wt.% Y2O3 + 5 wt. % MgAl2O4 additives. The PAS processing method for the silicon nitride additive mixtures is attractive for retention of fine-grained microstructures favorable for superplastic deformation. Post superplastic forming heat treatments to transform the α−Si3N4 to lath-like, creep-resistant β−Si3N4 is another feature of the present processing method.

Type
Articles
Information
Journal of Materials Research , Volume 11 , Issue 2 , February 1996 , pp. 358 - 362
Copyright
Copyright © Materials Research Society 1996

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References

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