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Reply to the comments of O. Jørgensen et al.

Published online by Cambridge University Press:  31 January 2011

A. Bagchi  and
A.G. Evans
A. Bagchi
Affiliation:
Division of Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
A.G. Evans
Affiliation:
Division of Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
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Abstract

Large scale yielding (LSY), in general, has a profound influence on the fracture toughness of metal/dielectric interfaces. For thin metal film/dielectric systems exhibiting “weak” bonding, small-scale yielding (SSY) prevails due to local plastic dissipation intrinsic to crack growth and the high yield strength of metal thin films. For systems involving low yield strength materials and strong interfaces, a more detailed LSY methodology needs to be developed.

Type
Articles
Information
Journal of Materials Research , Volume 11 , Issue 8 , August 1996 , pp. 2111 - 2112
Copyright
Copyright © Materials Research Society 1996

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References

REFERENCES

1.Jørgensen, O., Horsewell, A., and Sørensen, B. F., J. Mater. Res. 11, 2109 (1996).CrossRefGoogle Scholar
2.Bagchi, A., Lucas, G. E., Suo, Z., and Evans, A. G., J. Mater. Res. 9, 1734 (1994).Google Scholar
3.Tvergaard, V. and Hutchinson, J. W., Philos. Mag. A70, 641 (1994).Google Scholar
4.Kim, K-S. and Aravas, N., Int. J. Solids Struct. 24, 417 (1988).Google Scholar
5.Evans, A. G. and Hutchinson, J.W., Acta Metall. Mater. 43, 2507 (1995).Google Scholar
6.Bagchi, A., Ph.D. Thesis, University of California at Santa Barbara (1994).Google Scholar
7.Bagchi, A. and Evans, A. G., Interfacial Science (in press).Google Scholar
8.Hutchinson, J. W., unpublished.Google Scholar
9.Zhuk, A. V., Evans, A. G., Hutchinson, J.W., and Whitesides, G. M., unpublished.Google Scholar
10.Nix, W. D., Metall. Trans. 20A, 2217 (1989).CrossRefGoogle Scholar
11.Venkatraman, R. and Bravman, J. C., J. Mater. Res. 7, 2040 (1992).Google Scholar
12.Vinci, R. P., Zielinski, E. M., and Bravman, J.C., Thin Solid Films 262, 142 (1995).CrossRefGoogle Scholar