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Role of the primary phase particles during the peritectic solidification of Y-123 superconducting oxides

Published online by Cambridge University Press:  31 January 2011

M. Kambara ,
M. Yoshizumi ,
T. Umeda ,
K. Miyake ,
K. Murata ,
T. Izumi  and
Y. Shiohara
M. Kambara
Affiliation:
Department of Metallurgy, Graduate School of Engineering, The University of Tokyo, 7–3-1, Hongo, Bunkyo-ku, Tokyo, 113–8656 Japan
M. Yoshizumi
Affiliation:
Department of Metallurgy, Graduate School of Engineering, The University of Tokyo, 7–3-1, Hongo, Bunkyo-ku, Tokyo, 113–8656 Japan
T. Umeda
Affiliation:
Department of Metallurgy, Graduate School of Engineering, The University of Tokyo, 7–3-1, Hongo, Bunkyo-ku, Tokyo, 113–8656 Japan
K. Miyake
Affiliation:
Graduate School of Engineering, Shibaura Institute of Technology, Shibaura, Minato-ku, Tokyo, 108–8548 Japan
K. Murata
Affiliation:
Graduate School of Engineering, Shibaura Institute of Technology, Shibaura, Minato-ku, Tokyo, 108–8548 Japan
T. Izumi
Affiliation:
Superconducting Research Laboratory, ISTEC, 1–10–13, Shinonome, Koto-ku, Tokyo, 135–0062 Japan
Y. Shiohara
Affiliation:
Superconducting Research Laboratory, ISTEC, 1–10–13, Shinonome, Koto-ku, Tokyo, 135–0062 Japan
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Abstract

Non-steady-state solidification of YBa2Cu3O6+δ (Y-123) superconducting oxides was observed by the isothermal undercooling experiment. A sudden decrease in crystal growth rate was found for all the Y-123 samples processed at the different temperatures and from the different Y2BaCuO5 (Y-211) contents in the initial composition. Quantitative analysis revealed that the Y-211 particles are pushed by the Y-123 crystal and accumulate in the liquid during solidification. It is also found that the particle volume fraction increased and reached a constant value of about 0.6, when the growth rate decreased abruptly, regardless of a variety of growth conditions. A simple solidification model is developed to interpret the experimental observation. This model shows that particle accumulation, as a result of the particle-pushing behavior, causes less connectivity of the liquid and thereby decreases the liquid diffusion flux, which is responsible for the non-steady-state solidification of Y-123.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 8 , August 2001 , pp. 2229 - 2238
Copyright
Copyright © Materials Research Society 2001

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