Hostname: page-component-7dd5485656-npwhs Total loading time: 0 Render date: 2025-10-31T10:57:50.064Z Has data issue: false hasContentIssue false
  • English
  • Français

Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections

Published online by Cambridge University Press:  31 January 2011

Jong-Hyun Lee ,
Jong-Hwan Park ,
Yong-Ho Lee ,
Yong-Seog Kim  and
Dong Hyuk Shin
Jong-Hyun Lee
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Jong-Hwan Park
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Yong-Ho Lee
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Yong-Seog Kim
Affiliation:
Department of Metallurgy and Materials Science, Hong Ik University, Seoul 121-791, Korea
Dong Hyuk Shin
Affiliation:
Department of Metallurgy and Materials Science, Hanyang University, Ansan 425-791, Kyungki-Do, Korea
Get access

Abstract

The thermodynamic stability of the solder channels at a scalloplike Cu6Sn5 layer formed between Sn-containing solders and Cu substrate was evaluated by studying the penetration behavior of the liquid solders into the grain boundaries of a Cu6Sn5 substrate. The orientational relationship between the grains of the Cu6Sn5 layer formed during reflow soldering was also analyzed using the electron backscattered diffraction technique. The results showed that liquid solders penetrate into the grain boundaries at an order of faster speed than the growth rate of the layer, which provided a direct evidence of thermodynamic stability of the channel.

Information

Type
Rapid Communications
Information
Journal of Materials Research , Volume 16 , Issue 5 , May 2001 , pp. 1227 - 1230
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1.Quan, L., Frear, D., Grivas, D., and Morris, J.W. Jr., J. Electron. Mater. 15, 355 (1987).Google Scholar
2.Dirnfeld, S.F. and Ramon, J.J., Welding J. (Res. Suppl.) Oct., 373s (1990).Google Scholar
3.Frear, D.R., Hosking, F.M., and Vianco, P.T., Proc. Mater. Develop. Microelectron. Packag. Conf. 229 (1991).Google Scholar
4.Lau, J.H., Solder Joint Reliability (Van Nostrand Reinhold, New York, 1994), p. 93.Google Scholar
5.Klein Wassink, R.J., Soldering in Electronics, 2nd ed. (Electrochemical Publications Ltd., Ayr, Scotland, 1989).Google Scholar
6.Onishi, M. and Fujibuchi, H., Trnas. JIM 16, 539 (1975).CrossRefGoogle Scholar
7.Tu, K.N. and Thompson, R.D., Acta Metall. 30, 947 (1982).CrossRefGoogle Scholar
8.Romig, A.D. Jr., Chang, Y.A., Stephens, J.J., Frear, D.R., Marcotte, V., and Lea, C., Solder Mechanics: A State of the Art Assessment, edited by Frear, D.R., Jones, W.D., and Kinsman, K.R. (TMS, Warrendale, PA 1991), p. 29.Google Scholar
9.Mei, Z., Sunwoo, A.J., and Morris, J.W. Jr., Metall. Trans. 23A, 857 (1992).CrossRefGoogle Scholar
10.Bader, S., Gust, W., and Hieber, H., Acta Metall. Mater. 43, 329 (1995).Google Scholar
11.Kim, H.K. and Tu, K.N., Phys. Res. B 53, 16027 (1996).CrossRefGoogle Scholar
12.Schaefer, M., Laub, W., Sabee, J.M., and Fournelle, R.A., J. Electron. Mater. 25, 992 (1996).CrossRefGoogle Scholar
13.Su, L-H., Yen, Y-W., Lin, C-C., and Chen, S-W., Metall. Mater. Trans. 28B, 927 (1997).CrossRefGoogle Scholar
14.Vianco, P.T., Hopkins, P.L., Erickson, K.L., Frear, D.R., and Davidson, R., Design & Reliability of Solders and Solder Interconnections, edited by Mahidhara, R.K., Frear, D.R., Sastry, S.M.L., Murty, K.L., Liaw, P.K., and Winterbottom, W.L., Proceedings of a Symposium held during the TMS Annual Meeting, Orlando, FL, 1997, p. 161.Google Scholar
15.Schaefer, M., Laub, W., Fournelle, R.A., and Liang, J., Design & Reliability of Solders and Solder Interconnections, edited by Mahidhara, R.K., Frear, R.D., Sastry, S.M.L., Murty, K.L., Liaw, P.K., and Winterbottom, W.L., Proceedings of a Symposium held during the TMS Annual Meeting, Orlando, FL, 1997, p. 247.Google Scholar
16.Scaefer, M., Fournelle, R.A., and Liang, J., J. Electron. Mater. 27, 1167 (1998).CrossRefGoogle Scholar
17.Chada, S., Laub, W., Fournelle, R.A., and Shangguan, D., J. Electron. Mater. 28, 1194 (1999).CrossRefGoogle Scholar
18.Bartels, F., Morris, J.W. Jr., Dalke, G., and Gust, W., J. Electron Mater. 23, 787 (1994).CrossRefGoogle Scholar
19.Kim, H.K., Liou, H.K., and Tu, K.N., Appl. Phys. Lett. 66, 2337 (1995).CrossRefGoogle Scholar
20.Zuruzi, A.S., Chiu, C-H., Lahiri, S.K., and Tu, K.N., J. Appl. Phys. 86, 4916 (1999).CrossRefGoogle Scholar
21.Kim, H.K. and Tu, K.N., Appl. Phys. Lett. 67, 2002 (1995).CrossRefGoogle Scholar
22.Romig, A.D. Jr., Chang, Y.A., Stephens, J.J., Frear, D.R., Marcotte, V., and Lea, C., Solder Mechanics: A State of the Art Assessment, edited by Frear, D.R., Jones, W.D., and Kinsman, K.R. (TMS, Warrendale, PA, 1991), p. 191.Google Scholar
23.London, J. and Ashall, D.W., Brazing Soldering 11, 49 (1986).Google Scholar