Hostname: page-component-848d4c4894-ttngx Total loading time: 0 Render date: 2024-05-15T10:24:43.693Z Has data issue: false hasContentIssue false
  • English
  • Français

Stress in evaporated films used in GaAs processing

Published online by Cambridge University Press:  08 February 2011

W.A. Strifler  and
C.W. Bates Jr.
W.A. Strifler
Affiliation:
Watkins Johnson Company, 3333 Hillview Avenue, Palo Alto, California 94304 and Department of Electrical Engineering, Stanford University, Stanford, California 94305
C.W. Bates Jr.
Affiliation:
Department of Materials Science and Department of Electrical Engineering, Stanford University, Stanford, California 94305
Get access

Abstract

A simple and practical method is described for determining the residual stress in vapor deposited thin films that are less than 1000 Å in thickness. The method relies on the evaporation of thin films onto prefabricated micro-cantilever beams of SiO2. The vertical deflection at the end of the beam is measured using an optical microscope to determine the average film stress with a resolution of 25 MPa. Calculations show that the vapor deposition of metal films onto these beams does not induce significant heating, so the thermal component of residual film stress is minimal. The micro-cantilever technique is used to measure the film stress in 500 Å films of Al, Ti, Pt, Au, Ni, and Ge. These measured values are compared to similar measurements reported in the literature.

Type
Articles
Information
Journal of Materials Research , Volume 6 , Issue 3 , March 1991 , pp. 548 - 552
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Asbeck, P. M., Lee, C. P., and Chang, M. F., IEEE Trans. Electron Devices ED-31, 1377 (1984).CrossRefGoogle Scholar
2Hong, S., Weihs, T. P., Bravman, J. C., and Nix, W. D., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 93.Google Scholar
3Weihs, T. P., Hong, S., Bravman, J. C., and Nix, W. D., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 87.Google Scholar
4The CRC Handbook of Chemistry and Physics, edited by Weast, R. C., 51st ed. (CRC Press, Cleveland, OH, 1970), p. D–55.Google Scholar
5Thermophysical Properties of Matter, edited by Toulovkian, Y. S. (Plenum, New York, 1972), Vol. 5, Specific Heat of Nonmetallic Solids, p. 202.Google Scholar
6Handbook of Heat Transfer Fundamentals, edited by Rohsenow, W. M., Hartnett, J. P., and Ganic, E. N., 2nd ed. (McGraw-Hill, New York, 1985), pp. 14–21.Google Scholar
7Thermophysical Properties of Matter, edited by Toulovkian, Y. S. (Plenum, New York, 1972), Vol. 9, Thermal Radiative Properties of Coatings, p. 1048.Google Scholar
8Handbook of the Physicochemical Properties of the Elements edited by Samsonov, G. V. (Plenum, New York, 1968).Google Scholar
9Hu, C. K., Ho, P. S., and Gupta, D., in Thin Films: Stresses and Mechanical Properties edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), p. 255.Google Scholar
10Sinha, A. K. and Sheng, T. T., Thin Solid Films 48, 117 (1978).CrossRefGoogle Scholar
11Hershkovitz, M., Blech, I. A., and Komen, Y., Thin Solid Films 132, 87 (1986).Google Scholar
12Klokholm, E., J. Vac. Sci. Technol. 6, 138 (1969).CrossRefGoogle Scholar
13Ann, J. and Lewis, S. J., Thin Solid Films 23, S67 (1974).Google Scholar
14Tong, H. C., Lo, C. M., and Traber, W. F., J. Vac. Sci. Technol. 13, 99 (1976).Google Scholar
15Lau, S. S. and Sun, R. C., Thin Solid Films 10, 273 (1972).Google Scholar
16Wilcock, J. D., Campbell, D. S., and Anderson, J. C., Thin Solid Films 3, 13 (1969).Google Scholar
17Abermann, R. and Koch, R., Thin Solid Films 129, 71 (1985).Google Scholar
18Doljack, F. A. and Hoffman, R. W., Thin Solid Films 12, 71 (1972).CrossRefGoogle Scholar
19Alexander, P. M. and Hoffman, R. W., J. Vac. Sci. Technol. 13, 96 (1976).Google Scholar
20Ennos, A. E., Appl. Opt. 5, 51 (1966).Google Scholar