Hostname: page-component-848d4c4894-nmvwc Total loading time: 0 Render date: 2024-06-19T12:37:16.824Z Has data issue: false hasContentIssue false
  • English
  • Français

Whisker growth from an electroplated zinc coating

Published online by Cambridge University Press:  31 January 2011

Alongheng Baated ,
Keun-Soo Kim  and
Katsuaki Suganuma
Alongheng Baated*
Affiliation:
Graduate School of Engineering, Osaka University, Ibaraki, Osaka 567-0047, Japan
Keun-Soo Kim
Affiliation:
Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka 567-0047, Japan
Katsuaki Suganuma
Affiliation:
Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka 567-0047, Japan
*
a)Address all correspondence to this author. e-mail: aroohan@eco.sanken.osaka-u.ac.jp
Get access

Abstract

The formation of Zn whiskers threatens the reliable operation of electronic equipment with an electrical shorting hazard. As with tin whiskers (much more intensively researched than Zn whiskers), the mechanism of formation is still not clear. This work investigated the Zn whisker growth mechanism for an electroplated Zn coating above a carbon steel substrate from a raised floor tile. Iron–zinc (Fe–Zn) intermetallic and Zn oxides were identified by x-ray diffraction analysis (XRD) and electron probe microanalysis (EPMA). Fe–Zn intermetallic compounds formed on the surface of the Zn layer in addition to the interface between the Zn coating and the steel substrate. Zn oxides formed primarily on the surface of the Zn coating. Fe–Zn intermetallic compounds and Zn oxide formation can be the source of a residual stress that promotes Zn diffusion to the surface of electroplated Zn coating, resulting in the formation of Zn whiskers.

Keywords

ZnCoatingCompound
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 11 , November 2010 , pp. 2175 - 2182
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Cobb, H.L.: Cadmium whiskers. Monthly Rev. Amer. Electroplaters Soc. 33, (28)28 (1946)Google Scholar
2.Comptom, K.G., Mendizza, A., Arnold, S.M.: Filamentary growths on metal surfaces “Whiskers”. Corrosion 7, (10)327 (1951)Google Scholar
3.Galyon, G.T.: A history of tin whisker theory: 1946 to 2004, SMTAI International Conference (Chicago 2004)http://www.nemi.org/projects/ese/tin_whikser_activities.htmlGoogle Scholar
4.Smetana, J.: Theory of tin whisker growth: The end game. IEEE Trans-EPM 30, (1)11 (2007)Google Scholar
5.Arnold, S.M.: The growth of metal whiskers on electrical components, Proceedings of the IEEE Electronic Components Conference(1959)7582Google Scholar
6.Lindborg, U.: A model for the spontaneous growth of zinc, cadmium and tin whiskers. Acta Metall. 24, (2)181 (1976)Google Scholar
7.Tu, K.N.: Copper/tin interfacial reactions: Thin-film case versus bulk case. Mater. Chem. Phys. 46, (2-3)217 (1996)Google Scholar
8.Britton, S.C.: Spontaneous growth of whiskers on tin coatings. Twenty years of observation. Trans. Inst. Met. Finish. 52, 95 (1974)Google Scholar
9.Lee, B-Z., Lee, D.N.: Spontaneous growth mechanism of tin whiskers. Acta Mater. 46, (10)3701 (1998)Google Scholar
10.Osenbach, J.W., DeLucca, J.M., Potterger, B.D., Amin, A., Shook, R.L., Baiocchi, F.A.: Sn corrosion and its influence on whisker growth. IEEE Trans. Electron. Packag. Manuf. 30, (1)23 (2007)Google Scholar
11.Lingborg, U.: Observations of the growth of whisker crystals from zinc electroplate. Metall. Trans. A 6( August )1581 (1975)Google Scholar
12.Brusse, J., Sampson, M.: Zinc Whiskers: Hidden Cause of Equipment Failure (IEEE Computer Society 2004)4347Google Scholar
13.Herring, C., Galt, J.K.: Elastic properties of very small specimens. Phys. Rev. 85, (6)1060 (1952)Google Scholar
14.Brandes, E.A., Brook, G.B.: Smithells Metals Reference Book 7th ed (Butterworth-Heinemann Ltd, Oxford, UK 1992)Google Scholar
15.http://nepp.nasa.gov/whisker/photos/floor_tile/floor-tile-underside.jpgGoogle Scholar
16.Cullity, B.D.: Elements of X-ray Diffraction 2nd ed (Addison-Wesley, Reading, MA 1978)Google Scholar
17.Fang, T., Osterman, M., Mathew, S., Pecht, M.: Tin whisker risk assessment. Circuit World 32, (3)19 (2006)Google Scholar
18.JEDEC Standard JESD22-A121A Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes (JEDEC Solid State Technology Association 2008)Google Scholar