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Analysis of Thermal and Mechanical Effects on Residual Stress in Minimum Quantity Lubrication (MQL) Machining

Published online by Cambridge University Press:  09 February 2016

X. Ji*
Affiliation:
School of Mechanical EngineeringDonghua UniversityShanghai, China
B.-Z. Li
Affiliation:
School of Mechanical EngineeringDonghua UniversityShanghai, China
Steven Y. Liang
Affiliation:
School of Mechanical EngineeringDonghua UniversityShanghai, China The George W.Woodruff School of Mechanical EngineeringGeorgia Institute of TechnologyAtlanta, USA
*
*Corresponding author (jixia@dhu.edu.cn)
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Abstract

A physics-based model of residual stress in minimum quantity lubrication (MQL) machining is presented. The stresses resulting from thermal and mechanical loading in the MQL machining process are coupled into an incremental thermal-elastic-plastic model for predicting the final resultant residual stress in the machined workpiece. Comparative analysis is made between the stresses produced by the thermal load and mechanical load in the machining process. Results manifest that for the surface of the machined workpiece, the stress produced by thermal load is on par with the contact stress produced by mechanical load in the magnitude. With the increase of depth into the workpiece, the stress produced by mechanical load is dominant of the total stresses. The rationale demonstrates that thermal load is prone to generate the tensile residual stress at the surface of the machined workpiece, while the mechanical load is prone to generate the compressive residual stress at the surface of the machined workpiece. Finally, the residual stress prediction model is verified by orthogonal cutting of AISI 4130 alloy steel.

Type
Research Article
Copyright
Copyright © The Society of Theoretical and Applied Mechanics 2018 

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References

1. Hadad, M. and Sadeghi, B., “Thermal Analysis of Minimum Quantity Lubrication-MQL Grinding Process,” International Journal of Machine Tools & Manufacture, 63, pp. 115 (2012).Google Scholar
2. Tai, B. L., Stephenson, D. A. and Shih, A. J., “Thermal Modeling of Workpiece Temperature in Mql Deep-Hole Drilling,” Proceedings of the ASME International Manufacturing Science and Engineering Conference, U.S.A. (2011).Google Scholar
3. Lin, Z.-C., Lin, Y.-Y. and Liu, C.R., “Effect of Thermal Load and Mechanical Load on the Residual Stress of a Machined Workpiece,” International Journal of Mechanical Sciences, 33, pp. 263278 (1991).CrossRefGoogle Scholar
4. Ulutan, D., Erdem Alaca, B. and Lazoglu, I., “Analytical Modelling of Residual Stresses in Machining,” Journal of Materials Processing Technology, 183, pp. 7787 (2007).Google Scholar
5. Liang, S. Y. and Su, J.-C., “Residual Stress Modeling in Orthogonal Machining,” CIRP Annals-Manufacturing Technology, 56, pp. 6568 (2007).Google Scholar
6. Qi, Z. X., Li, B. and Xiong, L. S., “An Improved Algorithm for McDowell's Analytical Model of Residual Stress,” Frontiers of Mechanical Engineering, 9, pp. 150155 (2014).Google Scholar
7. Chuang, W. C., Lin, D. T. W., Hu, Y. C., Lee, H. L., Cheng, C. H., Chang, P. Z. and Quyen, N. B., “A Method Integrating Optimal Algorithm and FEM on CMOS Residual Stress,” Journal of Mechanics, 30, pp. 123128 (2014).Google Scholar
8. Ji, X., Zhang, X. P. and Liang, S. Y., “A New Approach to Predict Machining Force and Temperature with Minimum Quantity Lubrication,” Proceedings of the ASME International Manufacturing Science and Engineering Conference, U.S.A. (2012).Google Scholar
9. Ji, X., Zhang, X. P. and Liang, S. Y., “Predictive Modeling of Residual Stress in Minimum Quantity Lubrication Machining,” The International Journal of Advanced Manufacturing Technology, 70, pp. 21592168 (2014).Google Scholar
10. Saif, M., Hui, C. and Zehnder, A., “Interface Shear Stresses Induced by Non-Uniform Heating of a Film on a Substrate,” Thin Solid Films, 224, pp. 159167 (1993).CrossRefGoogle Scholar