Lu, H., Bailey, C. and Yin, C., “Design for Reliability of Power Electronics Modules,” Microelectronics Reliability, 49, pp. 1250–1255 (2009).
Hung, T. Y., Chiang, S. Y., Huang, C. J., Lee, C. C. and Chiang, K. N., “Thermal-Mechanical Behavior of the Bonding Wire for a Power Module Subjected to the Power Cycling Test,” Microelectronics Reliability, 51, pp. 1819–1823 (2011).
Yoon, S. W., Glover, M. D., Mantooth, H. A. and Shiozaki, K., “Reliable and Repeatable Bonding Technology for High Temperature Automotive Power Modules for Electrified Vehicles,” Journal of Micromechanics and Microengineerin, 23, 015017 (2013).
Lang, F., Nakagawa, H., Aoyagi, M., Ohashi, H. and Yamaguchi, H., “A Novel Chip Joint Method for High Temperature Operated SiC Power Modules,” Proceedings of the 8th Electronics Packaging Technology Conference, Singapore, pp. 597–603 (2006).
Lang, F., Hayashi, Y., Nakagawa, H., Aoyagi, M. and Ohashi, H., “A Novel Three-Dimensional Packaging Method for Al-Metalized SiC Power Devices,” IEEE Transactions on Advanced Packaging, 32, pp. 773–779 (2009).
Kanata, T., Nishiwaki, K. and Hamada, K., “Development Trends of Power Semiconductors for Hybrid Vehicles,” Proceedings of the International Power Electronics Conference, Sapporo, Japan, pp. 778–782 (2010).
Thebaud, J. M.
et al., “Strategy for Designing Accelerated Aging Tests to Evaluate IGBT Power Modules Lifetime in Real Operation Mode,” IEEE Transactions on Components and Packaging Technologies, 26, pp. 429–438 (2003).
Ciappa, M., “Selected Failure Mechanisms of Modern Power Modules,” Microelectronics Reliability, 42, pp. 653–667 (2002).
Yin, C. Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M., “A Physics-of-Failure Based Prognostic Method for Power Modules,” Proceedings of the 10th Electronics Packaging Technology Conference, Singapore, pp. 1190–1195 (2008).
Shinohara, K. and Qiang, Y., “Fatigue Evaluation of Power Devices,” Proceedings of the International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, pp. 1277–1283 (2009).
Yu, Q., Shibutani, T., Tanaka, A., Koyama, T. and Shiratori, M., “Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices,” Proceedings of the ASME Inter-PACK Conference, Vancouver, Canada, pp. 531–537 (2007).
Lee, N. C., “Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects,” Proceedings of the International Conference Surface Mount Technology Association, Chicago, IL, USA, (2000).
Bernstein, L., “Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process: I. The Systems Ag-In, Au-In, and Cu-In,” Journal of The Electrochemical Society, 113, pp. 1282–1288 (1966).
Jacobson, D. M. and Humpston, G., “Diffusion Soldering,” Soldering and Surface Mount Technology, 4, pp. 27–32 (1992).
Lee, C. C., Wang, C. Y. and Matijasevic, G., “Advances in Bonding Technology for Electronic Packaging,” Journal of Electronic Packaging, 115, pp. 201–207 (1993).
Okamoto, H., “Au-Sn (Gold-Tin),” Journal of Phase Equilibria and Diffusion, 28, 490 (2007).
Suganuma, K., Kim, S. J. and Kim, K. S., “High-Temperature Lead-Free Solders: Properties and Possibilities,” Journal of Mechanics, 61, pp. 64–71 (2009).
Lang, F., Nakagawa, H., Aoyagi, M., Ohashi, H. and Yamaguchi, H., “Impact of Joint Materials on the Reliability of Double-Side Packaged SiC Power Devices During High Temperature Aging,” Journal of Materials Science: Materials in Electronics, 21, pp. 917–925 (2010).
Lang, F., Hayashi, Y., Nakagawa, H., Aoyagi, M. and Ohashi, H., “Joint Reliability of Double-Side Packaged SiC Power Devices to a DBC Substrate with High Temperature Solders,” Proceedings of the 10th Electronics Packaging Technology Conference, Singapore, pp. 897–902 (2008).
Hagler, P., Johnson, R. W. and Chen, L. Y., “SiC Die Attach Metallurgy and Processes for Applications up to 500°C,” IEEE Transactions on Components and Packaging Technologies, 1, pp. 630–639 (2011).
Tollefsen, T., Larsson, A., Løvvik, O. and Aasmundtveit, K., “Au-Sn SLID Bonding-Properties and Possibilities,” Metallurgical and Materials Transactions B, 43, pp. 397–405 (2012).
Oppermann, H., The Role of Au/Sn Solder in Packaging, Springer, London, p. 377 (2005).
et al., “Investigations of Au-Sn Alloys on Different End-Metallizations for High Temperature Applications [solders],” Proceedings of the 22th International Electronics Manufacturing Technology Symposium, Berlin, Germany, pp. 156–165 (1998).
et al., “Computational Modeling of Creep-Based Fatigue as a Means of Selecting Lead-Free Solder Alloys,” Microelectronics Reliability, 54, pp. 1235–1242 (2014).
Che, F. X., Zhu, W. H., Poh, E. S. W., Zhang, X. W. and Zhang, X. R., “The Study of Mechanical Properties of Sn-Ag-Cu Lead-Free Solders with Different Ag Contents and Ni Doping under Different Strain Rates and Temperatures,” Journal of Alloys and Compounds, 507, pp. 215–224 (2010).
Chen, X., Chen, G. and Sakane, M., “Prediction of Stress-Strain Relationship with an Improved Anand Constitutive Model for Lead-Free Solder Sn-3.5 Ag,” IEEE Transactions on Components and Packaging Technologies, 28, pp. 111–116 (2005).
Wang, G. Z., Cheng, Z. N., Becker, K. and Wilde, J., “Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys,” Journal of Electronic Packaging, 123, pp. 247–253 (2001).
Liu, D. S. and Chao, Y. C., “Effects of Dopant, Temperature, and Strain Rate on the Mechanical Properties of Micrometer Gold-Bonding Wire,” Journal of Electronic Materials, 32, pp. 159–165 (2003).
Sahli, A., Boufeldja, S., Kebdani, S. and Rahmani, O., “Failure Analysis of Anisotropic Plates by the Boundary Element Methos,” Journal of Mechanics, 30, pp. 561–570 (2014).