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Characterization of Thin Films using Micromechanical Structures

Published online by Cambridge University Press:  15 February 2011

R. I. Pratt ,
G. C. Johnson ,
R. T. Howe  and
D. J. Nikkel Jr.
R. I. Pratt
Affiliation:
Berkeley Sensor & Actuator Center, University of California, Berkeley, CA 94720 Department of Mechanical Engineering, University of California, Berkeley, CA 94720
G. C. Johnson
Affiliation:
Berkeley Sensor & Actuator Center, University of California, Berkeley, CA 94720 Department of Mechanical Engineering, University of California, Berkeley, CA 94720
R. T. Howe
Affiliation:
Berkeley Sensor & Actuator Center, University of California, Berkeley, CA 94720 Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720
D. J. Nikkel Jr.
Affiliation:
Lawrence Livermore National Laboratory, Livermore, CA 94550
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Abstract

Micromechanical structures designed for material characterization through analysis of their nonlinear dynamic response are presented. The structures consist of a rigid movable mass supported by beams which are attached to the wafer substrate. The structures are designed so that they are geometrically constrained, which is the source of their nonlinearity. The nonlinearity is shown to be well modeled by Duffing's equation for a stiffening spring and it is this model which is used to fit the test data to the desired mechanical properties, namely Young's modulus, intrinsic stress and damping.

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References

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