Hostname: page-component-848d4c4894-p2v8j Total loading time: 0.001 Render date: 2024-05-18T14:06:57.793Z Has data issue: false hasContentIssue false

Fracture Behavior of Micro-Sized Specimens Prepared From an Amorphous Alloy Thin Film at Ambient and Elevated Temperatures

Published online by Cambridge University Press:  21 March 2011

K. Takashima
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama, 226-8503, Japan
R. Tarumi
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama, 226-8503, Japan
Y. Higo
Affiliation:
Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama, 226-8503, Japan
Get access

Abstract

Fracture behavior of micro-sized cantilever beam type specimens prepared from an electroless deposited Ni-P amorphous alloy thin film has been investigated at ambient and elevated temperatures. Cantilever beam type specimens with dimensions of 10 x 12 x 50 μm3 were prepared from an electroless deposited Ni-P amorphous alloy thin film and notches were introduced by focused ion beam machining. Fatigue pre-cracks were introduced ahead of the notches. The introduction of fatigue pre-crack and fracture toughness tests were carried out using a mechanical testing machine for micro-sized specimens. The temperature of the specimen was controlled from room temperature to 473 K using a newly developed heating system. Compared with room temperature, fracture toughness increased approximately 40 % at 373 K but decreased 19 % at 473 K. The increase of fracture toughness at 373 K is considered to be related with the formation of nano-sized crystals and the decrease of fracture toughness at 473 K is considered to be due to the growth of crystals. It is required to consider the fracture behavior obtained in this investigation when designing actual MEMS devices using electroless deposited amorphous films.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Takashima, K., Shimojo, M., Higo, Y. and Swain, M. V., ASTM STP-1413, 72 (2001).Google Scholar
2. Takashima, K., Shimojo, M., Higo, Y. and Swain, M. V., ASTM STP-1413, 52 (2001).Google Scholar
3. Takashima, K., Higo, Y., Sugiura, S. and Shimojo, M., Mater. Trans. 42, 68 (2001).Google Scholar
4. Mizutani, Y., Higo, Y., Ichikawa, Y., Morita, A., Takashima, K. in Materials Science of Microelectromechanical Systems (MEMS) Devices III, edited by Kahn, H., Boer, M. de, Judy, M. and Spearing, S. M., (Mater. Res. Soc. Proc. 657, Pittsburgh, PA, 2001), pp. EE5.11.15.11.6.Google Scholar
5. Taub, A. I. and Spaepan, F., Acta Metall. 28, 1781 (1980).Google Scholar
6. Beukel, A. van den and Radelaar, S., Acta Metall. 31, 419 (1983).Google Scholar
7. Khonik, V. A., Kosilov, A. T., Mikhailov, V. A. and Svirdov, V. V., Acta Mater. 46, 3399 (1998).Google Scholar
8. Ichikawa, Y., Maekawa, S., Takashima, K., Shimojo, M., Higo, Y. and Swain, M. V., in Materials Science of Microelectromechanical Systems (MEMS) Devices II, edited by Boer, M. P. de, Heuer, A. H., Jacobs, S. J. and Peeters, E., (Mater. Res. Soc. Proc. 605, Pittsburgh, PA, 2000), pp. 273278.Google Scholar
9. Maekawa, S., Takashima, K., Shimojo, M., Higo, Y., Sugiura, S., Pfister, B and Swain, M. V., Jpn. J. Apply. Phys. 38, 7194 (1999).Google Scholar
10. Inoue, A., Acta Mater., 48, 279 (2000).Google Scholar
11. Xing, L. Q., Herlach, D. M., Cornet, M., Bertrand, C., Dallas, J. P., Trichet, M. F. and Chevalier, C. J., Ma.er. Sci. & Eng. A226–228, 857 (1997).Google Scholar