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Multistep, In-Situ Single Wafer Processing - Materials, Device and Equipment Issues

Published online by Cambridge University Press:  25 February 2011

J. R. Hauser ,
N. A. Masnari  and
M. A. Littlejohn
J. R. Hauser
Affiliation:
North Carolina State University, Raleigh, North Carolina 27695-7911
N. A. Masnari
Affiliation:
North Carolina State University, Raleigh, North Carolina 27695-7911
M. A. Littlejohn
Affiliation:
North Carolina State University, Raleigh, North Carolina 27695-7911
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Abstract

Multistep, in-situ single wafer processing is being explored as an alternative processing approach to standard batch silicon wafer processing. Advantages and disadvantages of this approach are explored and an evaluation given of the potential for future advanced, low temperature wafer processing. Multistep, single wafer processing offers many advantages for advanced device and IC development but much technology research and equipment development is needed to achieve its potential.

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