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Numerical Simulation and Validation of Multiscale 3D Laser Spiral Machining of Microholes

Published online by Cambridge University Press:  01 January 2024

Yiwei Dong*
Affiliation:
School of Aerospace, Xiamen University, Xiamen 361005, Fujian Province, China
Qianwen Ye
Affiliation:
School of Aerospace, Xiamen University, Xiamen 361005, Fujian Province, China
Qi Li
Affiliation:
ENN Energy Power Technology (Shanghai) Co., Ltd, Shanghai 201306, China
Xiang Guo
Affiliation:
School of Aerospace, Xiamen University, Xiamen 361005, Fujian Province, China
Saitao Zhang
Affiliation:
School of Aerospace, Xiamen University, Xiamen 361005, Fujian Province, China
Naixian Hou
Affiliation:
AECC Commercial Aircraft Engine Co., Ltd, Shanghai 200241, China
*
Correspondence should be addressed to Yiwei Dong; ywdong@mit.edu

Abstract

Femtosecond laser ablation is widely applied in high-precision machining of microholes in aeroengine turbine blades. To further explore the mechanism of action during the laser processing of microholes, numerical simulations were performed on the basis of a molecular dynamics (MD) method coupled with a two-temperature model (TTM). Laser irradiation on the surface of copper for different femtosecond-laser processing parameters is investigated in this work. Through the femtosecond-laser single-pulse central ablation simulation model, the laser energy flux density in a Gaussian laser spot range was discretized and analyzed to calculate the ablation depth at multiple points separately. The cross-sectional morphology of the femtosecond-laser single-pulse ablation pits was approximated and fitted. Finally, a 3D simulation model of the whole process of multiscale femtosecond-laser spiral processing microholes was established by superimposing multipulse femtosecond-laser spiral trajectories. This provides a theoretical basis for analyzing the evolution of geometric parameters and morphological characteristics of the hole during machining with specific laser and process parameters.

Information

Type
Research Article
Creative Commons
Creative Common License - CCCreative Common License - BY
This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright
Copyright © 2022 Yiwei Dong et al.
Figure 0

Figure 1: Schematic diagram of a single cell of a copper crystal.

Figure 1

Figure 2: Dimensions and boundary conditions of the model.

Figure 2

Table 1: Different energy densities for femtosecond laser ablation.

Figure 3

Figure 3: Surface electron and lattice temperatures at different energies: (a) surface electron temperature and (b) surface lattice temperature.

Figure 4

Figure 4: Schematic diagram of atomic snapshots at different energy flux: (a) 1000 J/m2, (b) 2232 J/m2, (c) 3188 J/m2, and (d) 4782 J/m2.

Figure 5

Table 2: Laser parameter settings for the second group of calculations.

Figure 6

Figure 5: Schematic diagram of atomic snapshots at different energy densities: (a) 3188 J/m2, (b) 4782 J/m2, (c) 6377 J/m2, and (d) 7971 J/m2.

Figure 7

Figure 6: Comparison of ablation depth with laser energy.

Figure 8

Table 3: Laser energy flux and ablation depth simulation results.

Figure 9

Figure 7: Femtosecond-laser single-pulse ablation crater morphology fitting results.

Figure 10

Table 4: Femtosecond-laser spiral machining process parameters.

Figure 11

Figure 8: Distribution of spot centers of multiple laser pulses: (a) simulation and (b) actual processing.

Figure 12

Figure 9: Simulation of the central cross section of the film-cooling hole obtained by femtosecond-laser spiral processing.

Figure 13

Figure 10: Schematic diagram of the actual ablation cross-section structure.