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Thermomechanical behavior at the nanoscale and size effects in shape memory alloys

Published online by Cambridge University Press:  10 October 2011

Jose San Juan*
Affiliation:
Departamento de Física Materia Condensada, Facultad de Ciencia y Tecnología, Universidad del País Vasco, Apdo 644, 48080 Bilbao, Spain
Maria L. Nó
Affiliation:
Departamento de Física Aplicada II, Facultad de Ciencia y Tecnología, Universidad del País Vasco, Apdo 644, 48080 Bilbao, Spain
Christopher A. Schuh
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
*
a)Address all correspondence to this author. e-mail: jose.sanjuan@ehu.es

Abstract

Shape memory alloys (SMA) undergo reversible martensitic transformation in response to changes in temperature or applied stress, resulting in the properties of superelasticity and shape memory. At present, there is high scientific and technological interest to develop these properties at small scales and apply SMA as sensors and actuators in microelectromechanical system technologies. To study the thermomechanical properties of SMA at micro and nanoscales, instrumented nanoindentation is widely used to conduct nanopillar compression tests. By using this technique, superelasticity and shape memory at the nanoscale have been demonstrated in micro and nanopillars of Cu–Al–Ni SMA. However, the martensitic transformation seems to exhibit different behavior at small scales, and a size effect on superelasticity has been recently reported. In this study, we provide an overview of the thermomechanical properties of Cu–Al–Ni SMA at the nanoscale, with special emphasis on size effects. Finally, these size effects are discussed in light of the microscopic mechanisms controlling the martensitic transformation at the nanoscale.

Information

Type
Invited Feature Papers
Copyright
Copyright © Materials Research Society 2011
Figure 0

TABLE I. Samples used to machine micropillars and nanopillars by focused ion beam, and further nanocompression testing with a nanoindenter. Sample I, with Af < RT is devoted to superelastic tests. Sample III, with Ms > RT is devoted for shape memory tests. Sample II, with Ms < RT < Af can be used for both kinds of tests, as explained in the text.

Figure 1

FIG. 1. (a) Scanning electron micrograph of a typical micropillar in the center of the crater milled by focused ion beam (FIB). (b) Contact-mode topography image acquired with the indenter tip. (c) Image of the top of the micropillar for precise positioning of the indenter before the compression test. (d) Image taken just after a series of compression tests, showing the residual indent.

Figure 2

FIG. 2. (a) The first few cycles of compression on a pillar of 1.6-μm diameter milled from Sample I, showing superelastic behavior and the small residual deformation linked to the local plastic deformation under the indenter tip. (b) Enlarged area to appreciate the residual displacement during the cycles, which become nearly closed when the maximum load is not increased. In both cases, the number of each cycle has been labeled.

Figure 3

FIG. 3. Examples of completely reversible superelastic behavior in Cu–Al–Ni shape memory alloys. (a) Pillar of 1.6-μm diameter on Sample I. (b) Pillar of 1.9-μm mean diameter on Sample I. (c) Pillar of 900-nm diameter on Sample II. (d) Pillar of 1.8-μm mean diameter on Sample II. For an easy identification, the pillar diameter ϕ has been indicated in each picture.

Figure 4

FIG. 4. (a) Compression test and stress-induced martensitic transformation in a pillar of Sample III, which becomes stable in the martensite phase. (b) Micrograph of the micropillar before the off-axis test. (c) Image of the same pillar deformed by bending just after the off-axis test. (d) Image of the pillar after heating, showing recovery by the one-way shape memory effect.

Figure 5

FIG. 5. Comparison of the compression stress–strain curves of a 900-nm-diameter pillar and the ones obtained on the same bulk single crystal from which the pillar has been FIBed. This picture evidence the size effect on the mechanical behavior at nanoscale because, according the Clausius–Clapeyron equation, the curve of the pillar should be below the one at 305 K.