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Lattice Boltzmann modelling of diverse particle deposition patterns by droplet evaporation

Published online by Cambridge University Press:  15 January 2026

Feifei Qin
Affiliation:
Institute of Extreme Mechanics, School of Aeronautics, National Key Laboratory of Aircraft Configuration Design, Key Laboratory for Extreme Mechanics of Aircraft of Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an, Shannxi 710072, PR China Chair of Building Physics, Department of Mechanical and Process Engineering, ETH Zürich (Swiss Federal Institute of Technology in Zürich), Zürich 8092, Switzerland
Linlin Fei*
Affiliation:
Chair of Building Physics, Department of Mechanical and Process Engineering, ETH Zürich (Swiss Federal Institute of Technology in Zürich), Zürich 8092, Switzerland Key Laboratory of Thermo-fluid Science and Engineering, Ministry of Education, School of Energy and Power Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, PR China
Jianlin Zhao
Affiliation:
Chair of Building Physics, Department of Mechanical and Process Engineering, ETH Zürich (Swiss Federal Institute of Technology in Zürich), Zürich 8092, Switzerland College of Petroleum Engineering, China University of Petroleum, Beijing, PR China
Sauro Succi
Affiliation:
Center for Life Nano Science at La Sapienza, Fondazione Istituto Italiano di Tecnologia, Viale Regina Margherita 295, Roma 00161, Italy Physics Department and Institute for Applied Computational Science, John A. Paulson School of Applied Science and Engineering, Harvard University, Oxford Street 29, Cambridge, MA 02138, USA
Dominique Derome
Affiliation:
Dep. of Civil and Building Engineering, Université de Sherbrooke, Sherbrooke, QC J1K 2R1, Canada
Jan Carmeliet
Affiliation:
Chair of Building Physics, Department of Mechanical and Process Engineering, ETH Zürich (Swiss Federal Institute of Technology in Zürich), Zürich 8092, Switzerland
*
Corresponding author: Linlin Fei, linlinfei@xjtu.edu.cn

Abstract

In this work, we propose a lattice Boltzmann model (LBM) to simulate diverse particle deposition patterns induced by isothermal droplet evaporation. The model is composed of two distributions, for the multiphase flow with phase change, and the particle transport with deposition, coupled with a contact angle hysteresis model for the contact line stick-slip dynamics. The model is validated by two benchmarks, and our simulations agree well with the theoretical solutions or experimental results. With the validated LBM, we first reproduced diverse deposition patterns, ranging from the coffee ring, uniform, to mountain-type patterns in single and multiple symmetrical/unsymmetrical forms. Then a parametric study is conducted to investigate how the solvent/particle/substrate properties affect the evaporation dynamics and resultant deposition patterns. Afterwards, we apply the average ratio ($r_{\phi ,a}$) of particles deposited at the droplet periphery and the centre to quantitatively classify the diverse emerging patterns. We show that $r_{\phi ,a}$ is controlled by the competition between the capillary transport and particle diffusion, leading to a linear dependence on the average Péclet number $\textit{Pe}_{a}$. Finally, we validated the scaling by lattice Boltzmann simulations with the proposed $\textit{Pe}_{a}$ spanning over three orders of magnitude, supplemented by discussions from the aspect of the particle transport equation.

Information

Type
JFM Papers
Creative Commons
Creative Common License - CCCreative Common License - BY
This is an Open Access article, distributed under the terms of the Creative Commons Attribution licence (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted re-use, distribution and reproduction, provided the original article is properly cited.
Copyright
© The Author(s), 2026. Published by Cambridge University Press
Figure 0

Figure 1. Illustration of various particle deposition patterns after evaporation of a colloidal droplet. (a) Colloidal droplet evaporation on a flat surface. (b) Coffee ring (Yunker et al.2011). (c) Uniform deposition pattern (Yunker et al.2011). (d) Mountain type (Li et al.2014). (e) Symmetrical multiple rings (Yang et al.2014). ( f) Unsymmetrical multiple rings (Maheshwari et al.2008).

Figure 1

Figure 2. (a) Droplet on a flat surface with contact angle $\theta$, where $\boldsymbol {n}_s$ is the surface vector of the liquid–vapour interface pointing to the vapour phase. (b) Illustration of the halfway bounce-back scheme on a flat surface.

Figure 2

Figure 3. Model validation by liquid droplet evaporation considering contact angle hysteresis ${\theta _{\textit{eq}}} = 80^\circ$, ${\theta _A} = 90^\circ$ and ${\theta _{R}} = 10^\circ$, respectively. (a) Profiles of the evaporating droplet experiencing transition from stick (${t_0} - {t_3}$) to slip (${t_3} - {t_4}$) mode. (b) Zoom-in of capillary flow (white streamlines) from droplet centre to contact lines inside the droplet, and the evaporation mass flux distribution (black arrows) around the droplet surface, at the contact angle ${\theta } = 25^\circ$. The contour indicates the vapour velocity outside the droplet. (c) Comparison of normalised droplet contact radius and contact angle between the current LBM simulation and theoretical results in Wilson & D’Ambrosio (2023), considering two different contact angle hysteresis ranges: ${\theta _{\textit{eq}}} = 80^\circ$, ${\theta _A} = 90^\circ$, ${\theta _R} = 10^\circ$ and ${\theta _{\textit{eq}}} = 60^\circ$, ${\theta _A} = 90^\circ$, ${\theta _R} = 30^\circ$.

Figure 3

Figure 4. Model validation by colloidal droplet evaporation considering contact angle hysteresis ${\theta _{\textit{eq}}} = 22.7^\circ$ and ${\theta _{R}} = 5^\circ$, respectively. (a) Evolution of contact angle and normalised contact radius during evaporation. (b) The accumulation of particles at droplet contact line at three different contact angles. (c) Comparison of particle accumulation at pinned contact line against time during evaporation, with $\phi _{\textit{pin}}$ the concentration at the contact line, and $\phi _{\textit{total}}$ the total concentration. (d) Comparison of final particle deposition against normalised droplet contact radius between experiment (Yunker et al.2011), modelling result from literature (Zhang et al.2021) and current LBM result.

Figure 4

Figure 5. Different deposition patterns with corresponding droplet internal flows. (ac) Ring, uniform and mountain-like deposition patterns (see supplementary movies 1–3). (df) Streamlines and velocity contours inside the droplet corresponding to (ac), with given liquid kinematic viscosity $v_l$ and particle diffusion coefficient $D_{\!p}$. The initial concentration in all three cases is ${\phi _0} = 0.5\,\%$, the surface tension is $\sigma = 8.6 \times {10^{ - 3}}\ {\textrm{N}}\,\text{m}^{- 1}$, and the initial and receding contact angles are ${\theta _{\textit{eq}}} = 35^\circ$ and ${\theta _R} = 5^\circ$.

Figure 5

Figure 6. (a) The advective velocity distribution and (b) particle concentration profile along the substrate at different time frames during the evaporation process.

Figure 6

Figure 7. Multiring formation considering spatially non-uniform/uniform contact angle hysteresis. (a,b) Consecutive stick-slip behaviour during colloidal droplet evaporation with uniform contact angle hysteresis range ${\theta _{\textit{eq}}} = 60^\circ ,{\theta _R} = 30^\circ$ and non-uniform ones, i.e. ${\theta _{\textit{eq}}} = 60^\circ$ with ${\theta _{R,L}} = 20^\circ$ and ${\theta _{R,R}} = 30^\circ$ at the left and right half-domains (see supplementary movies 4 and 5). (c,d) Evolution of contact angle $\theta$ and normalised contact radius ${R_c}/{R_{c,0}}$ during evaporation corresponding to cases (a,b). (e) Comparison of final deposition patterns in cases (a,b). ( f) Particle concentration contour at two time frames during evaporation in case (b), with streamlines showing the capillary transport contributing to the particle accumulation at contact point $A_0$.

Figure 7

Figure 8. The comparison of multi-ring deposition of particles at different liquid viscosity. (a) The slipping stage in the last period of the evaporation process. (b) The final deposition profile.

Figure 8

Figure 9. Different deposition patterns after colloidal droplet evaporation with consecutive stick-slip processes, where the red solid and blue dashed curves correspond to uniform and non-uniform contact angle hysteresis ranges given in figures 7(a) and 7(b). (a) Symmetrical and unsymmetrical multiple ring depositions (see supplementary movies 6 and 7) at ${\mu _l} = 1.7 \times {10^{ - 2}} \ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, $\sigma = 6.4 \times {10^{ - 3}} \ {\textrm{N}}\,\text{m}^{- 1}$ and ${D_{\!p}} = 1.7 \times {10^{ - 9}}\ {\textrm{m}}^{2}\,\text{s}^{- 1}$. (b) Approximately uniform deposition patterns (supplementary movies 8 and 9) at ${\mu _l} = 1.7 \times {10^{ - 1}} \ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, $\sigma = 3.1 \times {10^{ - 3}} \ {\textrm{N}}\,\text{m}^{- 1}$ and ${D_{\!p}} = 1.7 \times {10^{ - 9}} \ {\textrm{m}}^{2}\,\text{s}^{- 1}$. (c) Multiple mountain-like deposition patterns (supplementary movies 10 and 11) at ${\mu _l} = 3.4 \times {10^{ - 1}} \ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, $\sigma = 1.2 \times {10^{ - 2}} \ {\textrm{N}}\,\text{m}^{- 1}$ and ${D_{\!p}} = 1.7 \times {10^{ - 8}} \ {\textrm{m}}^{2}\,\text{s}^{- 1}$.

Figure 9

Figure 10. Final particle deposition profiles under different liquid and particle properties and surface wettability: (a) surface tension $\sigma \in (4.9 \times {10^{ - 4}},1.5 \times {10^{ - 2}})\ {\textrm{N}}\,\text{m}^{- 1}$ with initial contact angle ${\theta _{\textit{eq}}} = 35^\circ$, liquid kinematic viscosity ${\mu _l} = 1.7 \times {10^{ - 2}} \ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$ and particle diffusion coefficient ${D_{\!p}} = 1.7 \times {10^{ - 9}} \ {\textrm{m}}^{2}\,\text{s}^{- 1}$; (b) ${\mu _l} \in (3.4 \times {10^{ - 3}},1.71)\ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$ with ${\theta _{\textit{eq}}} = 35^\circ$, $\sigma = 6.4 \times {10^{ - 3}}\ {\textrm{N}}\,\text{m}^{- 1}$ and ${D_{\!p}} = 1.7 \times {10^{ - 9}} \ {\textrm{m}}^{2}\,\text{s}^{- 1}$; (c) ${D_{\!p}} \in (8.6 \times {10^{ - 10}},1.1 \times {10^{ - 7}})\ {\textrm{m}}^{2}\,\text{s}^{- 1}$ with ${\theta _{\textit{eq}}} = 35^\circ$, ${\mu _l} = 1.7 \times {10^{ - 2}} \ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$ and $\sigma = 6.4 \times {10^{ - 3}}\ {\textrm{N}}\,\text{m}^{- 1}$; (d) ${\theta _{\textit{eq}}} \in (25^\circ ,85^\circ )$ with ${\mu _l} = 3.4 \times {10^{ - 2}} \ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, $\sigma = 7.5 \times {10^{ - 3}}\ {\textrm{N}}\,\text{m}^{- 1}$ and ${D_{\!p}} = 1.7 \times {10^{ - 9}} \ {\textrm{m}}^{2}\,\text{s}^{- 1}$.

Figure 10

Figure 11. Comparison of particle deposition profiles after colloidal droplet evaporation experienced symmetrical multiple stick-slip processes. (a) Illustration of the evaporation process with different evaporation conditions, where $\theta _{\textit{eq}}$ and $\theta _R$ represent the equilibrium and receding contact angles, respectively. (bd) Particle deposition profiles at different liquid and particle properties. Cases 1, 1 and 1′′: liquid dynamic viscosity ${\mu _l} = 1.7 \times {10^{ - 2}}\ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, surface tension $\sigma = 6.4 \times {10^{ - 3}}\ {\textrm{N}}\,\text{m}^{- 1}$ and particle diffusion coefficient ${D_{\!p}} = 1.7 \times {10^{ - 9}}\ {\textrm{m}}^{2}\,\text{s}^{- 1}$. Cases 2, 2 and 2′′: ${\mu _l} = 3.4 \times {10^{ - 1}}\ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, $\sigma = 1.2 \times {10^{ - 2}}\ {\textrm{N}}\,\text{m}^{- 1}$ and ${D_{\!p}} = 1.7 \times {10^{ - 9}}\ {\textrm{m}}^{2}\,\text{s}^{- 1}$. Cases 3, 3 and 3′′: ${\mu _l} = 1.7 \times {10^{ - 1}}\ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, $\sigma = 3.1 \times {10^{ - 3}}\ {\textrm{N}}\,\text{m}^{- 1}$ and ${D_{\!p}} = 1.7 \times {10^{ - 9}}\ {\textrm{m}}^{2}\,\text{s}^{- 1}$. Cases 4, 4 and 4′′: ${\mu _l} = 3.4 \times {10^{ - 1}}\ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, $\sigma = 1.2 \times {10^{ - 2}}\ {\textrm{N}}\,\text{m}^{- 1}$ and ${D_{\!p}} = 1.7 \times {10^{ - 8}}\ {\textrm{m}}^{2}\,\text{s}^{- 1}$. The corresponding average deposition ratios are ${r_{\phi ,a}} = 23.3,3.53,0.94,0.12$, ${r_{\phi ,a}} = 13.8,2.84,0.66,0.11$ and ${r_{\phi ,a}} = 5.77,1.31,0.47,0.11$, respectively.

Figure 11

Figure 12. Comparison of particle deposition profiles after colloidal droplet evaporation experienced unsymmetrical multiple stick-slip processes. (a) Illustration of the evaporation process with different evaporation conditions, where $\theta _{\textit{eq}}$, $\theta _{R,L}$ and $\theta _{R,R}$ represent the equilibrium contact angle and receding contact angles at the left and right half-domains, respectively. (bd) Particle deposition profiles at different liquid and particle properties. The parameters in cases 5–8, 5–8 and 5′′–8′′ are the same as those in cases 1–4, 1–4 and 1′′–4′′ in figure 11. The corresponding average deposition ratios are ${r_{\phi ,a}} = 44.1,5.06,0.92,0.20$, ${r_{\phi ,a}} = 29.4,2.61,0.90,0.25$ and ${r_{\phi ,a}} = 7.31,1.49,0.65,0.22$, respectively.

Figure 12

Figure 13. The approximately linear relation ${r_{\phi ,a}} \approx k*{\textit{Pe}_a},k = 6.7 \times {10^{ - 3}}$ between average deposition ratio $r_{\phi ,a}$ (ratio of particles at droplet peripheries over particles at centre) and estimated average dimensionless number $\textit{Pe}_a$ for a broad range of parameters, i.e. droplet initial contact angle ${\theta _{\textit{eq}}} \in (25^\circ ,85^\circ )$, droplet receding contact angle ${\theta _R} \in (5^\circ ,30^\circ )$, liquid dynamic viscosity ${\mu _l} \in (3.4 \times {10^{ - 3}},1.71)\ {\textrm{kg}}\,\textrm{m}^{-1} \, \textrm{s}^{-1}$, surface tension $\sigma \in (4.9 \times {10^{ - 4}},1.2 \times {10^{ - 2}})\ {\textrm{N}}\,\text{m}^{- 1}$ and particle diffusion coefficient ${D_{\!p}} \in (8.6 \times {10^{ - 10}},1.1 \times {10^{ - 7}})\ {\textrm{m}}^{2}\,\text{s}^{- 1}$.

Figure 13

Figure 14. Explanation of particle accumulation and the length scale by capillary convection and diffusion.

Figure 14

Figure 15. The comparison of simulation results between two different relative vapour pressure differences $({p_s} - {p_e})/{p_s} = 6.05\,\% ,5.55\,\%$, where ${p_s},{p_e}$ represent saturation and ambient vapour pressure. (a) The velocity contour with vectors representing the evaporation rate around the liquid–vapour interface. (b) The normalised evaporation rate at the liquid–vapour interface by the local evaporation rate at $(X - {X_m})/{R_{c,0}} = 0$ of each case. (c) The final particle deposition profiles.

Supplementary material: File

Qin et al. supplementary movie 1

Coffee ring deposition pattern after single stick-slip process.
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Qin et al. supplementary movie 2

Uniform deposition pattern after single stick-slip process.
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Qin et al. supplementary movie 3

Mountain-like deposition pattern after stick-slip process.
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Qin et al. supplementary movie 4

Symmetrical multiple ring deposition pattern after consecutive stick-slip processes.
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Qin et al. supplementary movie 5

Unsymmetrical multiple ring deposition pattern after consecutive stick-slip processes.
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Qin et al. supplementary movie 6

Strong symmetrical multiple ring deposition pattern after consecutive stick-slip processes.
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Qin et al. supplementary movie 7

Strong unsymmetrical multiple ring deposition pattern after consecutive stick-slip processes.
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Qin et al. supplementary movie 8

Symmetrical approximately uniform deposition pattern after consecutive stick-slip processes.
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Qin et al. supplementary movie 9

Unsymmetrical approximately uniform deposition pattern after consecutive stick-slip processes.
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Qin et al. supplementary movie 10

Symmetrical mountain-like deposition pattern after consecutive stick-slip processes.
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Qin et al. supplementary movie 11

Unsymmetrical mountain-like deposition pattrn after consecutive stick-slip processes.
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Qin et al. supplementary material

Qin et al. supplementary material
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