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Thermodynamic assessment of phase equilibria in the Sn-Au-Bi system with key experimental verification

Published online by Cambridge University Press:  31 January 2011

Feng Gao ,
Cuiping Wang ,
Xingjun Liu ,
Yoshikazu Takaku ,
Ikuo Ohnuma  and
Kiyohito Ishida
Xingjun Liu*
Affiliation:
Department of Materials Science and Engineering, College of Materials, Xiamen University, Xiamen 361005, People's Republic of China; and Research Center of Materials Design and Applications, Xiamen University, Xiamen 361005, People's Republic of China
Kiyohito Ishida
Affiliation:
Department of Materials Science, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
*
a)Address all correspondence to this author. e-mail: lxj@xmu.edu.cn
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Abstract

The phase equilibria at 200 °C, 250 °C, 300 °C, and 400 °C and the phase transformation of the Sn-Au-Bi system were investigated by using the electron probe micro-analyzer (EPMA) and differential scanning calorimeter (DSC), respectively. It is found that there is a new ternary intermetallic compound with a possible AuSn structure (called the ϕ phase in the present work), which has a limited solubility of Au in the Au-rich portion, and the ϕ phase decomposes peritectically at about 313 °C. Based on the experimental data reported in the previous papers and new experimental data determined by the present work, thermodynamic assessments of the Sn-Au-Bi system were carried out by the calculation of phase diagrams (CALPHAD) method. The thermodynamic parameters for describing the Gibbs free energy of each phase were optimized, and reasonable agreement between the calculated results and experimental data was obtained in the Sn-Au-Bi ternary system.

Keywords

Phase equilibriaMicrostructurePhase transformation

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Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 3 , March 2010 , pp. 576 - 586
Copyright
Copyright © Materials Research Society 2010

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References

REFERENCES

1.Abtew, M., Selvaduray, G.Lead-free solders in microelectronics. Mater. Sci. Eng., R 27, 95 (2000)CrossRefGoogle Scholar
2.Frear, D.R.Issues related to the implementation of Pb-free electronic solders in consumer electronics. J. Mater. Sci.—Mater. Electron. 18, 319 (2007)CrossRefGoogle Scholar
3.Li, Y., Wong, C.P.Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications. Mater. Sci. Eng., R 51, 1 (2006)CrossRefGoogle Scholar
4.Laurila, T., Vuorinen, V., Kivilahti, J.K.Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng., R 49, 1 (2005)CrossRefGoogle Scholar
5.Takaku, Y., Ohnuma, I., Kainuma, R., Yamada, Y., Yagi, Y., Nishibe, Y., Ishida, K.Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure and interfacial reaction. J. Electron. Mater. 35, 1926 (2006)CrossRefGoogle Scholar
6.Lee, B.J., Hwang, N.M., Lee, H.M.Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation. Acta Mater. 45, 1867 (1997)CrossRefGoogle Scholar
7.Ohnuma, I., Liu, X.J., Ohtani, H., Ishida, K.Thermodynamic database for phase diagrams in micro-soldering alloys. J. Electron. Mater. 28, 1164 (1999)CrossRefGoogle Scholar
8.Liu, X.J., Ohnuma, I., Wang, C.P., Jiang, M., Kainuma, R., Ishida, K., Ode, M., Koyama, T., Onodera, H., Suzuki, T.Thermodynamic database on microsolders and copper-based alloy systems. J. Electron. Mater. 32, 1265 (2003)CrossRefGoogle Scholar
9.Liu, X.J., Oikawa, K., Ohnuma, I., Kainuma, R., Ishida, K.The use of phase diagrams and thermodynamic databases for electronic materials. JOM 55, 53 (2003)CrossRefGoogle Scholar
10.Yamamoto, R., Takeda, Y., Yokoyama, H., Kimura, T., Nishida, K., Maeda, S., Teramoto, M.Effect of film construction on melting point and adhesion strength of Sn-Au-Bi multilayered lead-free solder. J. Jpn. Inst. Met. 68, 908 (2004)CrossRefGoogle Scholar
11.Kim, D., Lee, C.C.Fluxless bonding process in air using Sn–Bi–Au design. Mater. Sci. Eng., A 372, 261 (2004)CrossRefGoogle Scholar
12.Kang, U.B., Kim, Y.H.The microstructure characterization of ultrasmall eutectic Bi-Sn solder bumps on Au/Cu/Ti and Au/Ni/Ti under-bump metallization. J. Electron. Mater. 33, 61 (2004)CrossRefGoogle Scholar
13.Cho, M.G., Paik, K.W., Lee, H.M., Booh, S.W., Kim, T.G.Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging. J. Electron. Mater. 35, 35 (2006)CrossRefGoogle Scholar
14.Chen, C.M., Chen, L.T., Lin, Y.S.Electromigration-induced Bi segregation in eutectic SnBi solder joint. J. Electron. Mater. 36, 168 (2007)CrossRefGoogle Scholar
15.Young, B.L., Duh, J.G., Jang, G.Y.Compound formation for electroplated Ni and electroless Ni in the under-bump metallurgy with Sn-58Bi solder during aging. J. Electron. Mater. 32, 1463 (2003)CrossRefGoogle Scholar
16.Prince, A., Raynor, G.V., Evans, D.S.Phase Diagrams of Ternary Gold Alloys (The Institute of Metals, London 1990)Google Scholar
17.Kubaschewski, O.Ternary Alloys edited by G. Effenberg, F. Aldinger and A. Prince (VCH Publisher, New York 1995)207Google Scholar
18.Kattner, U.R.The thermodynamic modeling of multicomponent phase equilibria. JOM 49, 14 (2003)CrossRefGoogle Scholar
19.Redlich, O., Kister, A.T.Thermodynamics of nonelectrolyte solutions, x-y-t relations in a binary system. Ind. Eng. Chem. 40, 341 (1948)CrossRefGoogle Scholar
20.Liu, H.S., Liu, C.L., Ishida, K., Jin, Z.P.Thermodynamic modeling of the Au-In-Sn system. J. Electron. Mater. 32, 1290 (2003)CrossRefGoogle Scholar
21.Wang, J., Meng, F.G., Liu, H.S., Liu, L.B., Jin, Z.P.Thermodynamic modeling of the Au-Bi-Sb ternary system. J. Electron. Mater. 36, 568 (2007)CrossRefGoogle Scholar
22.Dinsdale, A.T.SGTE data for pure elements. Calphad 15, 317 (1991)CrossRefGoogle Scholar
23.Anderson, J-O., Helander, T., Hoglund, L., Shi, P.F., Sundaman, B.Thermo-Calc and Dictra, computational tools for materials science. Calphad 26, 273 (2002)CrossRefGoogle Scholar
24.Ohtani, H., Ishida, K.A thermodynamic study of the phase equilibria in the Bi-Sn-Sb system. J. Electron. Mater. 23, 747 (1994)CrossRefGoogle Scholar
25.Okamoto, H.Au-Sn (gold-tin). J. Phase Equilib. 14, 765 (1993)CrossRefGoogle Scholar