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Design and analysis of 3D-printed hybrid couplers for D-band applications

Published online by Cambridge University Press:  11 May 2021

K. Lomakin*
Affiliation:
Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuremberg, Erlangen, Germany
L. Klein
Affiliation:
Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuremberg, Erlangen, Germany
G. Gold
Affiliation:
Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuremberg, Erlangen, Germany
*
Author for correspondence: K. Lomakin, E-mail: konstantin.lomakin@fau.de
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Abstract

This work focuses on the impact of the build orientation on additively manufactured waveguide-based hybrid couplers for D-band frequency range and relates it to other sources of uncertainty within the overall manufacturing process and measurement instrumentation for the D-band frequency range. The designed specimens are first printed from UV curable photopolymer resin and subsequently metal coated by an electroless silver plating process, which in turn is improved by making use of the slotted waveguide approach. Although the requirements toward geometrical precision to achieve phase errors below 10° are in an order of 0.1 mm, a desktop grade DLP printer is utilized in this work in order to point out the prospects and limitations of additive manufacturing. Furthermore, waveguide paths with bends are part of the model and their impact on the measured attenuation is estimated explicitly.

Despite this narrow field of tolerances, one specimen could have been realized, which achieves a measured output magnitude imbalance of 0.7 dB over the frequency range from 120 to 155 GHz while at the same time exhibiting a phase deviation of only <10° from the desired 90°. With these demonstrated results, the proposed approach provides suitability for future applications in the D-band frequency range.

Information

Type
Research Paper
Creative Commons
Creative Common License - CCCreative Common License - BYCreative Common License - NCCreative Common License - SA
This is an Open Access article, distributed under the terms of the Creative Commons Attribution-NonCommercial-ShareAlike licence (http://creativecommons.org/licenses/by-nc-sa/4.0/), which permits non-commercial re-use, distribution, and reproduction in any medium, provided the same Creative Commons licence is included and the original work is properly cited. The written permission of Cambridge University Press must be obtained for commercial re-use.
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press in association with the European Microwave Association
Figure 0

Fig. 1. Minimal CAD model for optimization of coupling region.

Figure 1

Fig. 2. Cross-section of the optimized simulation model.

Figure 2

Table 1. Overview of geometrical parameters as optimized by simulation

Figure 3

Fig. 3. Maximum range of simulated Through and Couple paths for variation of ± 50 μm within critical geometry of coupling region (lc, dinset, t, and tedge) in Fig. 1.

Figure 4

Fig. 4. Maximum range of simulated phase difference at output between S31 and S41 for variation of ± 50 μm within critical geometry of coupling region (lc, dinset, t, and tedge) in Fig. 1.

Figure 5

Fig. 5. CAD model for simulation including waveguide test fixture.

Figure 6

Fig. 6. CAD model for simulation including slotted waveguide test fixture.

Figure 7

Fig. 7. Comparison of different simulation setups with: continuous line ⇔ S31 and dashed line ⇔ S41.

Figure 8

Fig. 8. Simulated deviation of phase difference from the ideal of 90° between through and couple ports due to asymmetry within path lengths.

Figure 9

Fig. 9. Adjusted manufacturing model of the proposed hybrid coupler.

Figure 10

Fig. 10. Cross-section of the coupling region.

Figure 11

Fig. 11. Model for estimating attenuation of test fixture.

Figure 12

Fig. 12. Manufactured through-type structure for estimating attenuation of test fixture.

Figure 13

Fig. 13. Build orientations of specimens A, B, and C as considered in this work.

Figure 14

Fig. 14. One of the manufactured specimens (orientation A).

Figure 15

Fig. 15. Measured spread of through and couple path for variation of screw torque.

Figure 16

Fig. 16. Measured maximum spread of phase difference between through and couple path for variation of screw torque.

Figure 17

Fig. 17. Measured test fixture attenuation.

Figure 18

Fig. 18. Measured matching |S11| (solid) and isolation |S21| (dashed) of the manufactured specimen for all orientation types A, B, and C.

Figure 19

Fig. 19. Measured through (solid) and couple (dashed) path for source at ports 1 and 2 of specimen orientation type A.

Figure 20

Fig. 20. Measured through (solid) and couple (dashed) path for source at ports 1 and 2 of specimen orientation type B.

Figure 21

Fig. 21. Measured through (solid) and couple (dashed) path for source at ports 1 and 2 of specimen orientation type C.

Figure 22

Fig. 22. Closeup on measured through (solid) and couple (dashed) path for source at ports 1 and 2 of specimen orientation type C compared with simulation results for slotted WG from Fig. 7.

Figure 23

Fig. 23. Measured magnitude imbalance between coupling and through paths with source at port 1 and 2 of specimens A, B, and C.

Figure 24

Fig. 24. Measured phase difference between through and coupling paths for source at ports 1, 2, 3, and 4 of specimen A.

Figure 25

Fig. 25. Measured phase difference between through and coupling paths for source at ports 1, 2, 3, and 4 of specimen B.

Figure 26

Fig. 26. Measured phase difference between through and coupling paths for source at ports 1, 2, 3, and 4 of specimen C as well as simulated range for asymmetry in waveguide feed paths of 0–100 μm with center at 50 μm length difference (green solid).